Data Sheet

74HC237-Q100
3-to-8 line decoder, demultiplexer with address latches
Rev. 1 — 14 January 2013
Product data sheet
1. General description
The 74HC237-Q100 is a 3-to-8 line decoder, demultiplexer with latches at the three
address inputs (An). The 74HC237-Q100 essentially combines the 3-to-8 decoder
function with a 3-bit storage latch. When the latch is enabled (LE = LOW), the
74HC237-Q100 acts as a 3-to-8 active LOW decoder. When the latch enable (LE) goes
from LOW-to-HIGH, the last data present at the inputs before this transition, is stored in
the latches. Further address changes are ignored as long as LE remains HIGH. The
output enable input (E1 and E2) controls the state of the outputs independent of the
address inputs or latch operation. All outputs are HIGH unless E1 is LOW and E2 is HIGH.
The 74HC237-Q100 is ideally suited for implementing non-overlapping decoders in
3-state systems and strobed (stored address) applications in bus-oriented systems.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Combines 3-to-8 decoder with 3-bit latch
 Multiple input enable for easy expansion or independent controls
 Active HIGH mutually exclusive outputs
 Low-power dissipation
 Complies with JEDEC standard no. 7A
 ESD protection:
 MIL-STD-883, method 3015 exceeds 2000 V
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
74HC237D-Q100 40 C to +125 C
Name
Description
Version
SO16
plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
4. Functional diagram
4
LE
Y0 15
Y1 14
Y2 13
1 A0
Y3 12
2 A1
INPUT
LATCHES
3 A2
3 TO 8
DECODER
Y4 11
Y5 10
Y6 9
Y7 7
5 E1
6 E2
001aab871
Fig 1.
Functional diagram
DX
4
1
C8
1
0
0
8D,G
7
2
3
0
2
3
2
4
5
5
4
&
6
6
7
15
14
13
12
11
10
9
7
LE
Y0
Y1
1
2
3
Y2
A0
A1
INPUT
LATCHES
A2
Y3
3 TO 8
DECODER Y4
Y5
Y6
Y7
15
14
X/Y
13
4
12
1
11
2
10
3
9
0
8D,1
1
8D,2
2
8D,4
3
4
7
5
5
&
001aab869
Logic symbol
74HC237_Q100
Product data sheet
7
15
14
13
12
11
10
9
7
EN
E2
Fig 2.
6
6
E1
5
6
C8
001aab870
Fig 3.
IEC logic symbol
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2 of 16
74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
A0
LATCH
A0
LE
A0
LE
Y0
Y1
A1
LATCH
A1
LE
A1
LE
Y2
A2
A2
LATCH
LE
A2
LE
Y3
Y4
LE
Y5
Y6
Y7
E1
001aab872
E2
Fig 4.
Logic diagram
74HC237_Q100
Product data sheet
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Rev. 1 — 14 January 2013
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74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
5. Pinning information
5.1 Pinning
+&4
$
9&&
$
<
$
<
/(
<
(
<
(
<
<
<
*1'
<
Fig 5.
Pin configuration SO16
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
A0 to A2
1, 2, 3
data input
LE
4
latch enable input (active LOW)
E1
5
data enable input 1 (active LOW)
E2
6
data enable input 2 (active HIGH)
Y0 to Y7
15, 14, 13, 12, 11, 10, 9, 7 output
GND
8
ground (0 V)
VCC
16
supply voltage
74HC237_Q100
Product data sheet
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74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
6. Functional description
Table 3.
Function table
Enable
Input
Output
LE
E1
E2
A0
A1
A2
Y0
H
L
H
X
X
X
stable
X
H
X
X
X
X
X
X
L
X
X
X
L
L
H
L
L
L
L
L
H
H
L
L
L
H
L
L
L
H
H
L
L
H
L
L
L
L
[1]
Y1
Y2
Y3
Y4
Y5
Y6
Y7
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
H
L
H
L
L
L
H
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
H
L
L
L
L
H
L
L
L
H
H
L
H
L
L
L
L
L
H
L
L
L
H
L
H
L
H
H
L
L
L
L
L
L
H
L
H
H
H
L
L
L
L
L
L
L
H
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Max
Unit
0.5
+7
V
IIK
input clamping current
VI < 0.5 V or VI > VCC + 0.5 V
-
20
mA
IOK
output clamping current
VO < 0.5 V or VO > VCC + 0.5 V
-
20
mA
IO
output current
VO = 0.5 V to (VCC + 0.5 V)
-
25
mA
ICC
supply current
-
+50
mA
IGND
ground current
-
50
mA
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
500
mW
[1]
[1]
For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC
supply voltage
2.0
5.0
6.0
V
VI
input voltage
0
-
VCC
V
VO
output voltage
0
-
VCC
V
Tamb
ambient temperature
40
+25
+125
C
74HC237_Q100
Product data sheet
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Rev. 1 — 14 January 2013
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74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
Table 5.
Recommended operating conditions …continued
Voltages are referenced to GND (ground = 0 V) …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
t/V
input transition rise and fall rate
VCC = 2.0 V
-
-
625
ns/V
VCC = 4.5 V
-
1.67
139
ns/V
VCC = 6.0 V
-
-
83
ns/V
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Tamb = 25 C
Conditions
Min
VIH
VIL
VOH
VOL
HIGH-level
input voltage
LOW-level
input voltage
HIGH-level
output voltage
LOW-level
output voltage
Typ
Tamb = 40 C to
+85 C
Max
Min
Max
Tamb = 40 C to Unit
+125 C
Min
Max
VCC = 2.0 V
1.5
1.2
-
1.5
-
1.5
-
V
VCC = 4.5 V
3.15
2.4
-
3.15
-
3.15
-
V
VCC = 6.0 V
4.2
3.2
-
4.2
-
4.2
-
V
VCC = 2.0 V
-
0.8
0.5
-
0.5
-
0.5
V
VCC = 4.5 V
-
2.1
1.35
-
1.35
-
1.35
V
VCC = 6.0 V
-
2.8
1.8
-
1.8
-
1.8
V
IO = 20 A; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = 20 A; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = 20 A; VCC = 6.0 V
5.9
6.0
-
5.9
-
5.9
-
V
IO = 4.0 mA; VCC = 4.5 V
3.98
4.32
-
3.84
-
3.7
-
V
IO = 5.2 mA; VCC = 6.0 V
5.48
5.81
-
5.34
-
5.2
-
V
IO = 20 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 A; VCC = 6.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 4.5 V
-
0.15
0.26
-
0.33
-
0.4
V
IO = 5.2 mA; VCC = 6.0 V
-
0.16
0.26
-
0.33
-
0.4
V
VI = VIH or VIL
VI = VIH or VIL
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
-
0.1
-
1.0
-
1.0
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
8.0
-
80
-
160
A
CI
input
capacitance
-
3.5
-
-
-
-
-
pF
74HC237_Q100
Product data sheet
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74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 9.
Symbol Parameter
tpd
propagation
delay
Tamb = 25 C
Conditions
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
-
52
160
-
200
-
240
ns
VCC = 4.5 V
-
19
32
-
40
-
48
ns
VCC = 5 V; CL = 15 pF
-
16
-
-
-
-
-
ns
VCC = 6.0 V
-
15
27
-
34
-
41
ns
VCC = 2.0 V
-
61
190
-
240
-
285
ns
VCC = 4.5 V
-
22
38
-
48
-
57
ns
VCC = 5 V; CL = 15 pF
-
19
-
-
-
-
-
ns
-
18
32
-
41
-
48
ns
E1to Yn; see Figure 7
[1]
[1]
VCC = 2.0 V
-
47
145
-
180
-
220
ns
VCC = 4.5 V
-
17
29
-
36
-
44
ns
VCC = 5 V; CL = 15 pF
-
14
-
-
-
-
-
ns
-
14
25
-
31
-
38
ns
VCC = 2.0 V
-
47
145
-
180
-
220
ns
VCC = 4.5 V
-
17
29
-
36
-
44
ns
VCC = 5 V; CL = 15 pF
-
14
-
-
-
-
-
ns
-
14
25
-
31
-
38
ns
VCC = 2.0 V
-
19
75
-
95
-
110
ns
VCC = 4.5 V
-
7
15
-
19
-
22
ns
VCC = 6.0 V
-
6
13
-
16
-
19
ns
VCC = 2.0 V
50
11
-
65
-
75
-
ns
VCC = 4.5 V
10
4
-
13
-
15
-
ns
VCC = 6.0 V
9
3
-
11
-
13
-
ns
VCC = 2.0 V
50
6
-
65
-
75
-
ns
VCC = 4.5 V
10
2
-
13
-
15
-
ns
VCC = 6.0 V
9
2
-
11
-
13
-
ns
VCC = 6.0 V
E2 to Yn; see Figure 6
[1]
VCC = 6.0 V
tW
tsu
pulse width
set-up time
74HC237_Q100
Product data sheet
Unit
[1]
VCC = 6.0 V
transition
time
Tamb = 40 C
to +125 C
Min
An to Yn; see Figure 6
LE to Yn; see Figure 6
tt
Tamb = 40 C
to +85 C
Yn; see Figure 6 and
Figure 7
[2]
LE HIGH; see Figure 8
An to LE; see Figure 8
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74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 9.
Symbol Parameter
th
hold time
Tamb = 25 C
Conditions
power
dissipation
capacitance
Tamb = 40 C
to +125 C
Min
Max
Max
Unit
Min
Typ
Max
Min
VCC = 2.0 V
30
3
-
40
-
45
-
ns
VCC = 4.5 V
6
1
-
8
-
9
-
ns
5
1
-
7
-
8
-
ns
-
60
-
-
-
-
-
pF
An to LE; see Figure 8
-
VCC = 6.0 V
CPD
Tamb = 40 C
to +85 C
[3]
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
[1]
tpd is the same as tPLH and tPHL.
[2]
tt is the same as tTHL and tTLH.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL  VCC2  fo) = sum of outputs.
11. Waveforms
An, E2, LE
input
VM
tPHL
Yn output
tPLH
90 %
90 %
VM
10 %
10 %
tTHL
tTLH
001aab873
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6.
Propagation delay input (An) and enable inputs (E2, LE) to output (Yn) and output transition time
74HC237_Q100
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Product data sheet
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74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
E1 input
VM
tPHL
tPLH
90 %
Yn output
90 %
VM
10 %
10 %
tTHL
tTLH
001aab874
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7.
Propagation enable inputs (E1) to output (Yn) and output transition time
VM
An input
tsu
LE input
transparant
th
VM
latched
th
tsu
transparant
latched
tW
001aab875
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8.
Table 8.
The data input (An) to latch enable input (LE) set-up times, latch enable input (LE) to data input (An) hold
times and latch enable input (LE) pulse width
Measurement points
Type
74HC237-Q100
74HC237_Q100
Product data sheet
Input
Output
VM
VM
0.5VCC
0.5VCC
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74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
VI
negative
pulse
tW
90 %
VM
VM
10 %
GND
tr
tf
tr
tf
VI
90 %
positive
pulse
GND
VM
VM
10 %
tW
VCC
G
VI
VO
DUT
RT
CL
001aah768
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 9.
Table 9.
Test circuit for measuring switching times
Test data
Type
Input
VI
tr, tf
CL
74HC237-Q100
VCC
6.0 ns
15 pF, 50 pF
74HC237_Q100
Product data sheet
Load
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Rev. 1 — 14 January 2013
Test
tPLH, tPHL
© NXP B.V. 2013. All rights reserved.
10 of 16
74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
12. Application information
strobe
decoder enable
X0
X1
X2
LE
A2 A1 A0
237
E2 E1
Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
0 1 2 3 4 5 6 7
input
address
to five
other
decoders
X3
X4
X5
LE
A2 A1 A0
237
E2 E1
Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
0 1 2 3 4 5 6 7
outputs
LE
A2 A1 A0
237
E2 E1
Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
8 9 10 11 12 13 14 15
LE
A2 A1 A0
237
E2 E1
Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
16 17 18 19 20 21 22 23
outputs
outputs
001aab876
Fig 10. 6-to-64 line decoder with input address storage
74HC237_Q100
Product data sheet
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Rev. 1 — 14 January 2013
© NXP B.V. 2013. All rights reserved.
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74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
13. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT109-1 (SO16)
74HC237_Q100
Product data sheet
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Rev. 1 — 14 January 2013
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74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
14. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
MIL
Military
TTL
Transistor-Transistor Logic
15. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74HC237_Q100 v.1
20130114
Product data sheet
-
-
74HC237_Q100
Product data sheet
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Rev. 1 — 14 January 2013
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13 of 16
74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74HC237_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 14 January 2013
© NXP B.V. 2013. All rights reserved.
14 of 16
74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74HC237_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 14 January 2013
© NXP B.V. 2013. All rights reserved.
15 of 16
74HC237-Q100
NXP Semiconductors
3-to-8 line decoder, demultiplexer with address latches
18. Contents
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2
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4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
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18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 January 2013
Document identifier: 74HC237_Q100