BGA Package 32-Lead (15mm × 11.25mm × 3.42mm) (Reference LTC DWG # 05-08-1851 Rev D) A 8 A2 aaa Z SEE NOTES DETAIL A Z 7 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.27 – 0.37 // bbb Z 2.45 – 2.55 H DETAIL B J K e L Øb (32 PLACES) ddd M Z X Y eee M Z X Y aaa Z E 3 PACKAGE BOTTOM VIEW DIMENSIONS 6.350 0.630 ±0.025 Ø 32x 5.080 0.000 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW 2. ALL DIMENSIONS ARE IN MILLIMETERS DETAIL A 4.445 3.175 1.905 0.000 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 0.635 0.635 1.905 3.175 4.445 SEE NOTES G DETAIL B PACKAGE SIDE VIEW PACKAGE TOP VIEW e b SYMBOL A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee MIN 3.22 0.50 2.72 0.60 0.60 NOM 3.42 0.60 2.82 0.75 0.63 15.0 11.25 1.27 12.70 8.89 MAX 3.62 0.70 2.92 0.90 0.66 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 32 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION BGA 32 1112 REV D