BGA Package 35-Lead (11.25mm × 6.25mm × 3.42mm) (Reference LTC DWG # 05-08-1878 Rev A) A aaa Z E Y Z A2 X SEE NOTES A ccc Z b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW Øb (35 PLACES) ddd M Z X Y eee M Z DETAIL B PACKAGE SIDE VIEW 2.540 1.270 0.000 0.3175 0.3175 1.270 2.540 4 3 2 1 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DETAIL A 4.445 3.175 5. PRIMARY DATUM -Z- IS SEATING PLANE DIMENSIONS 1.905 0.635 0.000 0.635 1.905 3.4925 F e 2.45 – 2.55 2.8575 7 PIN 1 3 A1 PIN “A1” CORNER SEE NOTES DETAIL A G 3.175 4.445 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee MIN 3.22 0.50 2.72 0.71 0.60 NOM 3.42 0.60 2.82 0.78 0.63 11.25 6.25 1.27 8.89 5.08 MAX 3.62 0.70 2.92 0.85 0.66 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 35 NOTES 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION BGA 35 1212 REV A