BGA Package 45-Lead (11.25mm × 9.00mm × 4.92mm) (Reference LTC DWG # 05-08-1869 Rev A) A aaa Z E Y Z A2 X SEE NOTES A ccc Z B 4 b C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z G H DETAIL B 7 PACKAGE TOP VIEW Øb (45 PLACES) DETAIL B PACKAGE SIDE VIEW 6 5 4 3 2 1 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 3.810 2.540 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.270 0.3175 0.3175 1.270 2.540 0.000 ddd M Z X Y eee M Z 3.810 F e 3.95 – 4.05 aaa Z 7 PIN 1 3 A1 PIN “A1” CORNER SEE NOTES DETAIL A G 4.445 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DETAIL A 3.175 1.905 0.635 0.000 0.635 1.905 3.175 4.445 SUGGESTED PCB LAYOUT TOP VIEW 5. PRIMARY DATUM -Z- IS SEATING PLANE DIMENSIONS 4.1275 4.7625 SYMBOL A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee MIN 4.72 0.50 4.22 0.71 0.60 NOM 4.92 0.60 4.32 0.78 0.63 11.25 9.0 1.27 8.89 7.62 MAX 5.12 0.70 4.42 0.85 0.66 NOTES 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 45 COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 45 1212 REV A