LGA Package 70-Lead (15mm × 9mm × 4.32mm) (Reference LTC DWG # 05-08-1817 Rev A) 9 BSC aaa Z SEE NOTES DETAIL A Y 7 6 5 4 3 2 4.22 – 4.42 7 1 C(0.30) PAD 1 A B PAD 1 CORNER MOLD CAP 4 C SUBSTRATE D 0.27 – 0.37 3.95 – 4.05 E DETAIL B 12.70 BSC Z // bbb Z 15 BSC F G H J 0.635 ±0.025 SQ. 70x eee S X Y DETAIL B K L aaa Z X PACKAGE TOP VIEW PADS SEE NOTES 3 3.810 2.540 1.270 0.000 1.270 2.540 3.810 1.27 BSC PACKAGE BOTTOM VIEW DETAIL A 6.350 5.080 3.810 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 2.540 1.270 0.000 1.270 2.540 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 70 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW 7.62 BSC SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 COMPONENT PAD “A1” TRAY PIN 1 BEVEL LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 70 1212 REV A