UHE Package Variation: UHE36(28)MA 36(28)-Lead Plastic QFN (5mm × 6mm) (Reference LTC DWG # 05-08-1836 Rev D) 28 27 25 24 23 21 20 0.70 ±0.05 30 1.88 ± 0.05 31 5.50 ± 0.05 4.10 ± 0.05 1.50 REF 3.00 ± 0.05 32 33 16 3.00 ± 0.05 0.12 ± 0.05 34 17 1.53 ± 0.05 15 14 PACKAGE OUTLINE 13 0.48 ± 0.05 12 35 36 1 2 3 4 6 0.50 BSC 8 9 0.25 ±0.05 10 2.00 REF 5.10 ± 0.05 6.50 ± 0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 ± 0.10 0.75 ± 0.05 R = 0.10 TYP PIN 1 TOP MARK (NOTE 6) 30 31 32 1.50 REF 33 34 35 28 27 2.00 REF 25 24 6.00 ± 0.10 1 1.88 ± 0.10 3.00 ± 0.10 0.12 ± 0.10 20 2 3 4 6 23 21 36 PIN 1 NOTCH R = 0.30 OR 0.35 × 45° CHAMFER 1.53 ± 0.10 0.48 ± 0.10 3.00 ± 0.10 8 R = 0.125 TYP 9 10 0.40 ± 0.10 0.200 REF 0.00 – 0.05 17 16 15 0.25 ± 0.05 0.50 BSC 14 13 12 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE (UHE36(28)MA) QFN 0112 REV D