UHE Package Variation: UHE36MA 36-Lead Plastic QFN (5mm × 6mm) (Reference LTC DWG # 05-08-1753 Rev A) 0.70 ±0.05 1.52 ±0.05 2.54 ±0.05 5.50 ±0.05 0.25 ±0.05 4.10 ±0.05 3.50 REF 3.45 ±0.05 3.45 ±0.05 PACKAGE OUTLINE 0.76 ±0.05 0.25 ±0.05 0.50 BSC 4.50 REF 5.10 ±0.05 6.50 ±0.05 RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 ±0.10 0.00 – 0.05 0.200 REF R = 0.10 TYP PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER 3.50 REF 35 36 0.40 ±0.10 PIN 1 TOP MARK (SEE NOTE 6) 1 2 2.54 ±0.10 6.00 ±0.10 3.45 ±0.10 4.50 REF 1.52 ±0.10 3.45 ± 0.10 (UHE36MA) QFN 0410 REV A 0.75 ± 0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 0.25 ±0.05 R = 0.125 TYP 0.50 BSC BOTTOM VIEW—EXPOSED PAD 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE