HEF4027B-Q100 Dual JK flip-flop Rev. 1 — 26 June 2013 Product data sheet 1. General description The HEF4027B-Q100 is an edge-triggered dual JK flip-flop which features independent set-direct (SD), clear-direct (CD), clock (CP) inputs and outputs (Q, Q). Data is accepted when CP is LOW, and transferred to the output on the positive-going edge of the clock. The active HIGH asynchronous clear-direct (CD) and set-direct (SD) inputs are independent and override the J, K, and CP inputs. The outputs are buffered for best system performance. Schmitt trigger action makes the clock input highly tolerant of slower rise and fall times. It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS (usually ground). Unused inputs must be connected to VDD, VSS, or another input. This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 3) and is suitable for use in automotive applications. 2. Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 3) Specified from 40 C to +85 C Fully static operation 5 V, 10 V, and 15 V parametric ratings Standardized symmetrical output characteristics ESD protection: MIL-STD-833, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) Complies with JEDEC standard JESD 13-B 3. Applications Registers Counters Control circuits HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop 4. Ordering information Table 1. Ordering information Tamb from 40 C to +85 C. Type number Package HEF4027BT-Q100 Name Description Version SO16 plastic small outline package; 16 leads; body SOT109-1 width 3.9 mm 5. Functional diagram FF 1 9 1SD 10 1J 13 1CP 11 1K 1Q 15 1Q 14 2Q 1 2Q 2 1CD 12 FF 2 7 2SD 6 2J 3 2CP 5 2K 2CD 4 001aae593 Fig 1. Functional diagram CP C J Q C C C C C C C Q K C C CD SD 001aae595 Fig 2. Logic diagram of one flip-flop HEF4027B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 2 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop 6. Pinning information 6.1 Pinning +()%4 4 9'' 4 4 &3 4 &' &3 . &' - . 6' - 966 6' DDD Fig 3. Pin configuration 6.2 Pin description Table 2. Pin description Symbol Pin Description VSS 8 ground supply voltage 1SD, 2SD 9, 7 asynchronous set-direct input (active HIGH) 1J, 2J 10, 6 synchronous input 1K, 2K 11, 5 synchronous input 1CD, 2CD 12, 4 asynchronous clear-direct input (active HIGH) 1CP, 2CP 13, 3 clock input (LOW-to-HIGH edge-triggered) 1Q, 2Q 14, 2 complement output 1Q, 2Q 15, 1 true output VDD 16 supply voltage 7. Functional description Table 3. Function table[1] Inputs Outputs nSD nCD nCP nJ nK nQ nQ H L X X X H L L H X X X L H H H X X X H H HEF4027B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 3 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop Table 3. Function table[1] …continued Inputs Outputs nSD nCD nCP nJ nK nQ nQ L L L L no change no change L L H L H L L L L H L H L L H H nQ nQ [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; = positive-going transition. 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD supply voltage Conditions VI < 0.5 V or VI > VDD + 0.5 V Min Max Unit 0.5 +18 V - 10 mA 0.5 VDD + 0.5 V - 10 mA - 10 mA IIK input clamping current VI input voltage IOK output clamping current II/O input/output current IDD supply current - 50 mA Tstg storage temperature 65 +150 C Tamb ambient temperature in free air 40 +85 C Ptot total power dissipation Tamb 40 C to +85 C - 500 mW P power dissipation per output - 100 mW [1] VO < 0.5 V or VO > VDD + 0.5 V [1] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C 9. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter Min Max Unit VDD supply voltage 3 15 V VI input voltage 0 VDD V Tamb ambient temperature in free air 40 +85 C t/V input transition rise and fall rate VDD = 5 V - 3.75 s/V VDD = 10 V - 0.5 s/V VDD = 15 V - 0.08 s/V HEF4027B_Q100 Product data sheet Conditions All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 4 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop 10. Static characteristics Table 6. Static characteristics VSS = 0 V; VI = VSS or VDD; unless otherwise specified. Symbol Parameter Conditions VDD Tamb = 40 C Min VIH VIL VOH VOL IOH IOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage HIGH-level output current LOW-level output current II input leakage current IDD supply current CI input capacitance HEF4027B_Q100 Product data sheet IO < 1 A Max Tamb = 25 C Tamb = 85 C Unit Min Min Max Max 5V 3.5 - 3.5 - 3.5 - V 10 V 7.0 - 7.0 - 7.0 - V 15 V 11.0 - 11.0 - 11.0 - V 5V - 1.5 - 1.5 - 1.5 V 10 V - 3.0 - 3.0 - 3.0 V 15 V - 4.0 - 4.0 - 4.0 V 5V 4.95 - 4.95 - 4.95 - V 10 V 9.95 - 9.95 - 9.95 - V 15 V 14.95 - 14.95 - 14.95 - V 5V - 0.05 - 0.05 - 0.05 V 10 V - 0.05 - 0.05 - 0.05 V 15 V - 0.05 - 0.05 - 0.05 V VO = 2.5 V 5V - 1.7 - 1.4 - 1.1 mA VO = 4.6 V 5V - 0.52 - 0.44 - 0.36 mA VO = 9.5 V 10 V - 1.3 - 1.1 - 0.9 mA VO = 13.5 V 15 V - 3.6 - 3.0 - 2.4 mA IO < 1 A IO < 1 A IO < 1 A VO = 0.4 V 5V 0.52 - 0.44 - 0.36 - mA VO = 0.5 V 10 V 1.3 - 1.1 - 0.9 - mA VO = 1.5 V 15 V 3.6 - 3.0 - 2.4 - mA 15 V - 0.3 - 0.3 - 1.0 A 5V - 4.0 - 4.0 - 30 A 10 V - 8.0 - 8.0 - 60 A 15 V - 16.0 - 16.0 - 120 A - - - - 7.5 - - pF IO = 0 A All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 5 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop 11. Dynamic characteristics Table 7. Dynamic characteristics VSS = 0 V; Tamb = 25 C; for test circuit, see Figure 7; unless otherwise specified. Symbol Parameter tPHL HIGH to LOW propagation delay Conditions CP Q, Q; see Figure 4 CD Q; see Figure 4 SD Q; see Figure 4 tPLH LOW to HIGH propagation delay CP Q, Q; see Figure 4 CD Q; see Figure 4 SD Q; see Figure 4 Extrapolation formula[1] VDD tsu th tW transition time set-up time hold time pulse width see Figure 4 J, K CP; see Figure 5 J, K CP; see Figure 5 CP LOW; minimum width, see Figure 5 SD, CD HIGH; minimum width, see Figure 6 trec recovery time HEF4027B_Q100 Product data sheet SD, CD inputs; see Figure 6 Typ Max Unit 5V 78 ns + (0.55 ns/pF)CL - 105 210 ns 10 V 29 ns + (0.23 ns/pF)CL - 40 80 ns 15 V 22 ns + (0.16 ns/pF)CL - 30 60 ns 5V 93 ns + (0.55 ns/pF)CL - 120 240 ns 10 V 33 ns + (0.23 ns/pF)CL - 45 90 ns 15 V 27 ns + (0.16 ns/pF)CL - 35 70 ns 5V 113 ns + (0.55 ns/pF)CL - 140 280 ns 10 V 44 ns + (0.23 ns/pF)CL - 55 110 ns 15 V 32 ns + (0.16 ns/pF)CL - 40 80 ns 5V 58 ns + (0.55 ns/pF)CL - 85 170 ns 10 V 27 ns + (0.23 ns/pF)CL - 35 70 ns 15 V 22 ns + (0.16 ns/pF)CL - 30 60 ns 5V 48 ns + (0.55 ns/pF)CL - 75 150 ns 10 V 24 ns + (0.23 ns/pF)CL - 35 70 ns 15 V 17 ns + (0.16 ns/pF)CL - 25 50 ns 5V 43 ns + (0.55 ns/pF)CL - 70 140 ns 10 V 19 ns + (0.23 ns/pF)CL - 30 60 ns 17 ns + (0.16 ns/pF)CL - 25 50 ns 10 ns + (1.00 ns/pF)CL - 60 120 ns 10 V 9 ns + (0.42 ns/pF)CL - 30 60 ns 15 V 6 ns + (0.28 ns/pF)CL - 20 40 ns 15 V tt Min 5V [2] 5V 50 25 - ns 10 V 30 10 - ns 15 V 20 5 - ns 5V 25 0 - ns 10 V 20 0 - ns 15 V 15 5 - ns 5V 80 40 - ns 10 V 30 15 - ns 15 V 24 12 - ns 5V 90 45 - ns 10 V 40 20 - ns 15 V 30 15 - ns 5V +20 15 - ns 10 V +15 10 - ns 15 V +10 5 - ns All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 6 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop Table 7. Dynamic characteristics …continued VSS = 0 V; Tamb = 25 C; for test circuit, see Figure 7; unless otherwise specified. Symbol Parameter Conditions fmax CP input; J = K = HIGH; see Figure 5 maximum frequency Extrapolation formula[1] VDD Min Typ Max Unit 5V 4 8 - MHz 10 V 12 25 - MHz 15 V 15 30 - MHz [1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF). [2] tt is the same as tTLH and tTHL. Table 8. Dynamic power dissipation PD PD can be calculated from the formulas shown. VSS = 0 V; tr = tf 20 ns; Tamb = 25 C. Symbol PD Parameter dynamic power dissipation VDD Typical formula for PD (W) Where: PD = 900 fi + (fo CL) VDD 5V 2 fi = input frequency in MHz; 10 V PD = 4500 fi + (fo CL) VDD2 fo = output frequency in MHz; 15 V PD = 13200 fi + (fo CL) CL = output load capacitance in pF; VDD2 VDD = supply voltage in V; (fo CL) = sum of the outputs. 12. Waveforms tr VI tf 90 % SD, CD or CP INPUT 0V VM 10 % tPLH VOH tPHL 90 % Q or Q OUTPUT VOL VM 10 % tTLH tTHL 001aah863 VOH and VOL are typical output voltages levels that occur with the output load. Measurement points are given in Table 9. Fig 4. Waveforms showing rise, fall and transition times and propagation delays 1/fmax tW CP INPUT VM th J,K INPUT VM tsu 001aae596 Measurement points are given in Table 9. Fig 5. Waveforms showing set-up and hold times and minimum clock pulse width HEF4027B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 7 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop VI SD INPUT VM 0V tW VI VM CD INPUT 0V tW trec trec VI VM CP INPUT 0V VOH Q OUTPUT VOL 001aae597 VOH and VOL are typical output voltages levels that occur with the output load. Measurement points are given in Table 9. Fig 6. Waveforms showing pulse widths and recovery times Table 9. Measurement points Supply voltage Input Output VDD VM VM 5 V to 15 V 0.5VDD 0.5VDD VDD VI VO G DUT CL RT 001aag182 Test data is given in Table 10. Definitions for test circuit: DUT = Device Under Test. CL = load capacitance including jig and probe capacitance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig 7. Test circuit Table 10. Test data Supply voltage Input VDD VI tr, tf CL 5 V to 15 V VSS or VDD 20 ns 50 pF HEF4027B_Q100 Product data sheet Load All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 8 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop 13. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 8. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT109-1 (SO16) HEF4027B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 9 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop 14. Abbreviations Table 11. Abbreviations Acronym Description HBM Human Body Model ESD ElectroStatic Discharge MM Machine Model MIL Military 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes HEF4027B_Q100 v.1 20130626 Product data sheet - - HEF4027B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 10 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. HEF4027B_Q100 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 11 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] HEF4027B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 June 2013 © NXP B.V. 2013. All rights reserved. 12 of 13 HEF4027B-Q100 NXP Semiconductors Dual JK flip-flop 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 26 June 2013 Document identifier: HEF4027B_Q100