UP Package 64-Lead Plastic QFN (9mm × 9mm) (Reference LTC DWG # 05-08-1705 Rev C) 0.70 ± 0.05 7.15 ± 0.05 7.50 REF 8.10 ± 0.05 9.50 ± 0.05 (4 SIDES) 7.15 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 9 .00 ± 0.10 (4 SIDES) 0.75 ± 0.05 R = 0.10 TYP R = 0.115 TYP 63 64 0.40 ± 0.10 PIN 1 TOP MARK (SEE NOTE 5) 1 2 PIN 1 CHAMFER C = 0.35 7.50 REF (4-SIDES) 7.15 ± 0.10 7.15 ± 0.10 0.200 REF 0.00 – 0.05 NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6. DRAWING NOT TO SCALE (UP64) QFN 0406 REV C 0.25 ± 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD