UKH Package 64-Lead Plastic QFN (7mm × 9mm) (Reference LTC DWG # 05-08-1741 Rev A) 0.70 ± 0.05 7.50 ± 0.05 6.10 ± 0.05 4.80 REF 5.41 ±0.05 7.15 ±0.05 PACKAGE OUTLINE 0.20 ± 0.05 0.40 BSC 7.20 REF 8.10 ± 0.05 9.50 ± 0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER 7.00 ± 0.10 0.75 ± 0.05 4.80 REF 63 0.00 – 0.05 0.40 ±0.10 PIN 1 TOP MARK (SEE NOTE 6) 9.00 ± 0.10 64 1 2 7.20 REF 7.15 ±0.10 5.41 ±0.10 (UKH64) QFN 0707 REV A 0.200 REF NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 0.20 ± 0.05 R = 0.115 TYP 0.40 BSC BOTTOM VIEW—EXPOSED PAD 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE R = 0.10 TYP