CO LO & MP LI GE AN N T FR EE Features Applications ■ Surface mount packaging for automated ■ Thermal protection for Li-ion & polymer ** HA *R oH S ■ ■ ■ ■ assembly Small footprint size (1206) and low profile for space-constrained mobile applications Ultra-low resistance RoHS compliant* and halogen free** Agency recognition: ■ ■ ■ ■ ■ ■ battery packs USB port protection - USB 2.0, 3.0 & OTG HDMI 1.4 Source protection PC motherboards - Plug & Play protection Mobile phones - Battery & port protection PDAs / digital cameras Game console port protection MF-NSML Series - Low Ohmic PTC Resettable Fuses Electrical Characteristics Ihold Model MF-NSML150 MF-NSML175 MF-NSML190 MF-NSML200 MF-NSML260 MF-NSML300 MF-NSML350 MF-NSML380 MF-NSML400 V max. Volts I max. Amps 6 6 6 6 6 6 6 6 6 50 50 50 50 50 50 50 50 50 Itrip Amperes at 23 °C Hold Trip 1.50 3.00 1.75 3.50 1.90 4.90 2.00 4.00 2.60 5.20 3.00 6.00 3.50 7.00 3.80 8.00 4.00 8.00 Resistance Ohms at 23 °C RMin. R1Max. 0.0100 0.0050 0.0050 0.0050 0.0030 0.0025 0.0020 0.0015 0.0015 0.0650 0.0300 0.0280 0.0250 0.0260 0.0200 0.0180 0.0140 0.0140 Max. Time To Trip Amperes at 23 °C Seconds at 23 °C 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 0.50 0.50 1.00 1.00 4.00 4.00 5.00 5.00 5.00 Tripped Power Dissipation Watts at 23 °C Typ. 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 Environmental Characteristics Operating Temperature......................................... -40 °C to +85 °C Maximum Device Surface Temperature in Tripped State .................................................... 125 °C Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±10 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change (Rmin<R<R1max) Condition A Test Procedures And Requirements For Model MF-NSML Series Test Test Conditions Accept/Reject Criteria Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage cUL File Number ................................................... E174545 http://www.ul.com/ Follow link to Certifications, then cUL File No., enter E174545 TÜV Certificate Number ....................................... R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. *Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-NSML PTC Resettable MF-NSMFSeries Series- -Low PTCOhmic Resettable Fuses Fuses Product Dimensions Model MF-NSML150 MF-NSML175 MF-NSML190 MF-NSML200 MF-NSML260 MF-NSML300 MF-NSML350 MF-NSML380 MF-NSML400 Min. 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) A Max. 3.50 (0.138) 3.50 (0.138) 3.50 (0.138) 3.50 (0.138) Min. 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) B Max. 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) C Max. 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) D Min. 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) Min. 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) Max. 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.50 (0.138) 3.50 (0.138) 3.50 (0.138) 3.50 (0.138) 3.50 (0.138) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) Packaging: 5000 pcs. per reel. Side View Top View A C E MM (INCHES) DIMENSIONS: Bottom View D Recommended Pad Layout E 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) 1.6 ± 0.1 (.063 ± .004) B 2.0 ± 0.1 (.079 ± .004) Terminal material: ENIG-plated terminals (Tin-plated terminals available upon request). Termination pad solderability: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. Thermal Derating Chart - Ihold (Amps) Model MF-NSML150 MF-NSML175 MF-NSML190 MF-NSML200 MF-NSML260 MF-NSML300 MF-NSML350 MF-NSML380 MF-NSML400 -40 °C 2.67 2.57 2.89 3.30 3.71 4.41 5.51 5.59 5.71 -20 °C 2.32 2.33 2.58 2.90 3.42 3.99 4.66 5.05 5.26 0 °C 1.95 2.07 2.25 2.50 3.01 3.54 4.13 4.48 4.63 Ambient Operating Temperature 23 °C 40 °C 50 °C 1.50 1.15 0.96 1.75 1.49 1.34 1.90 1.54 1.36 2.00 1.62 1.39 2.60 2.08 1.72 3.00 2.55 2.32 3.50 2.98 2.71 3.80 3.23 2.95 4.00 3.20 2.70 60 °C 0.78 1.24 1.21 1.16 1.49 2.13 2.49 2.70 2.29 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 70 °C 0.64 1.00 0.94 0.90 1.30 1.71 2.00 2.17 2.00 85 °C 0.52 0.91 0.77 0.52 0.89 1.56 1.82 1.98 1.37 3312 - 2 mm MF-NSML Series SMD - Low Trimming Ohmic PTC Potentiometer Resettable Fuses Solder Reflow Recommendations Notes: tp TP CRITICAL ZONE T L TO TP RAMP-UP TL • MF-NSML models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. • All temperatures refer to topside of the package, measured on the package body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Temperature tL TS MAX. RAMP-DOWN TS MIN. ts • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC Soldering Recommendation guidelines. • Designed for single solder reflow operations. PREHEAT 25 8 MINS. t 25 *C TO PEAK Time Profile Feature Average Ramp-Up Rate (TSmax to Tp) 3 °C / second max. Pb-Free Assembly PREHEAT: Temperature Min. (TSmin) Temperature Max. (TSmax) Time (tsmin to tsmax) 150 °C 200 °C 60~180 seconds Process TIME MAINTAINED ABOVE: Materials Description Temperature (TL) Time (tL) Temperature Time Interval 217 °C 60~150 seconds Peak / Classification Temperature (TP) 260 °C Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds Ramp-Down Rate 6 °C / second max. Time within 25 °C to Peak Temperature 8 minutes max. How to Order Typical Part Marking MF - NSML 200 - 2 Multifuse® Product Designator Series NSML = 1206 Low Ohmic Surface Mount Component Hold Current, Ihold 150 - 400 (1.50 Amps - 4.00 Amps) Packaging Packaged per EIA 481-1 -2 = Tape and Reel Represents total content. Layout may vary. NJ PART IDENTIFICATION: MF-NSML150 = NG MF-NSML175 = NH MF-NSML190 = NI MF-NSML200 = NJ MF-NSML260 = NN MF-NSML300 = NP MF-NSML350 = NS MF-NSML380 = NV MF-NSML400 = NU MANUFACTURING DATE CODE IS LOCATED ON PACKING LABEL. Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com MF-NSML SERIES, REV. E, 07/15 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-NSML Series - Low Ohmic PTC Resettable Fuses MF-NSML Series per EIA 481-2 12.0 ± 0.30 (0.472 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 1.90 ± 0.10 (0.075 ± 0.004) 3.50 ± 0.10 (0.138 ± 0.004) 4.5 (0.177) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.216 + 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 0.65 ± 0.10 (0.026 ± 0.004) 390 (15.35) 160 (6.30) Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 typ. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions 185 (7.283) 50 (1.97) 12.4 + 1/-0 (0.488 + 0.039/-0) 15.4 (0.606) A max. N min. W1 W2 max. DIMENSIONS: P0 T D0 P2 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. W1(MEASURED AT HUB)