mfnsml

CO
LO & MP
LI
GE
AN
N
T
FR
EE
Features
Applications
■ Surface mount packaging for automated
■ Thermal protection for Li-ion & polymer
**
HA
*R
oH
S
■
■
■
■
assembly
Small footprint size (1206) and low profile
for space-constrained mobile applications
Ultra-low resistance
RoHS compliant* and halogen free**
Agency recognition:
■
■
■
■
■
■
battery packs
USB port protection - USB 2.0, 3.0 & OTG
HDMI 1.4 Source protection
PC motherboards - Plug & Play protection
Mobile phones - Battery & port protection
PDAs / digital cameras
Game console port protection
MF-NSML Series - Low Ohmic PTC Resettable Fuses
Electrical Characteristics
Ihold
Model
MF-NSML150
MF-NSML175
MF-NSML190
MF-NSML200
MF-NSML260
MF-NSML300
MF-NSML350
MF-NSML380
MF-NSML400
V max.
Volts
I max.
Amps
6
6
6
6
6
6
6
6
6
50
50
50
50
50
50
50
50
50
Itrip
Amperes
at 23 °C
Hold
Trip
1.50
3.00
1.75
3.50
1.90
4.90
2.00
4.00
2.60
5.20
3.00
6.00
3.50
7.00
3.80
8.00
4.00
8.00
Resistance
Ohms
at 23 °C
RMin.
R1Max.
0.0100
0.0050
0.0050
0.0050
0.0030
0.0025
0.0020
0.0015
0.0015
0.0650
0.0300
0.0280
0.0250
0.0260
0.0200
0.0180
0.0140
0.0140
Max. Time
To Trip
Amperes
at 23 °C
Seconds
at 23 °C
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
0.50
0.50
1.00
1.00
4.00
4.00
5.00
5.00
5.00
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±10 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change (Rmin<R<R1max)
Condition A
Test Procedures And Requirements For Model MF-NSML Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max
Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
cUL File Number ................................................... E174545
http://www.ul.com/ Follow link to Certifications, then cUL File No., enter E174545
TÜV Certificate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
*Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-NSML
PTC Resettable
MF-NSMFSeries
Series- -Low
PTCOhmic
Resettable
Fuses Fuses
Product Dimensions
Model
MF-NSML150
MF-NSML175
MF-NSML190
MF-NSML200
MF-NSML260
MF-NSML300
MF-NSML350
MF-NSML380
MF-NSML400
Min.
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
A
Max.
3.50
(0.138)
3.50
(0.138)
3.50
(0.138)
3.50
(0.138)
Min.
1.40
(0.055)
1.40
(0.055)
1.40
(0.055)
1.40
(0.055)
B
Max.
1.80
(0.071)
1.80
(0.071)
1.80
(0.071)
1.80
(0.071)
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
C
Max.
0.60
(0.024)
0.60
(0.024)
0.60
(0.024)
0.60
(0.024)
D
Min.
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
Min.
0.05
(0.002)
0.05
(0.002)
0.05
(0.002)
0.05
(0.002)
Max.
0.45
(0.018)
0.45
(0.018)
0.45
(0.018)
0.45
(0.018)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.50
(0.138)
3.50
(0.138)
3.50
(0.138)
3.50
(0.138)
3.50
(0.138)
1.40
(0.055)
1.40
(0.055)
1.40
(0.055)
1.40
(0.055)
1.40
(0.055)
1.80
(0.071)
1.80
(0.071)
1.80
(0.071)
1.80
(0.071)
1.80
(0.071)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.60
(0.024)
0.60
(0.024)
0.60
(0.024)
0.60
(0.024)
0.60
(0.024)
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
0.05
(0.002)
0.05
(0.002)
0.05
(0.002)
0.05
(0.002)
0.05
(0.002)
0.45
(0.018)
0.45
(0.018)
0.45
(0.018)
0.45
(0.018)
0.45
(0.018)
Packaging: 5000 pcs. per reel.
Side View
Top View
A
C
E
MM
(INCHES)
DIMENSIONS:
Bottom View
D
Recommended Pad Layout
E
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)
1.6 ± 0.1
(.063 ± .004)
B
2.0 ± 0.1
(.079 ± .004)
Terminal material:
ENIG-plated terminals
(Tin-plated terminals available upon
request).
Termination pad solderability:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
Thermal Derating Chart - Ihold (Amps)
Model
MF-NSML150
MF-NSML175
MF-NSML190
MF-NSML200
MF-NSML260
MF-NSML300
MF-NSML350
MF-NSML380
MF-NSML400
-40 °C
2.67
2.57
2.89
3.30
3.71
4.41
5.51
5.59
5.71
-20 °C
2.32
2.33
2.58
2.90
3.42
3.99
4.66
5.05
5.26
0 °C
1.95
2.07
2.25
2.50
3.01
3.54
4.13
4.48
4.63
Ambient Operating Temperature
23 °C
40 °C
50 °C
1.50
1.15
0.96
1.75
1.49
1.34
1.90
1.54
1.36
2.00
1.62
1.39
2.60
2.08
1.72
3.00
2.55
2.32
3.50
2.98
2.71
3.80
3.23
2.95
4.00
3.20
2.70
60 °C
0.78
1.24
1.21
1.16
1.49
2.13
2.49
2.70
2.29
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
70 °C
0.64
1.00
0.94
0.90
1.30
1.71
2.00
2.17
2.00
85 °C
0.52
0.91
0.77
0.52
0.89
1.56
1.82
1.98
1.37
3312 - 2 mm
MF-NSML
Series
SMD
- Low
Trimming
Ohmic PTC
Potentiometer
Resettable Fuses
Solder Reflow Recommendations
Notes:
tp
TP
CRITICAL ZONE
T L TO TP
RAMP-UP
TL
•
MF-NSML models cannot be wave soldered or hand soldered. Please
contact Bourns for soldering recommendations.
•
All temperatures refer to topside of the package, measured on the
package body surface.
•
If reflow temperatures exceed the recommended profile, devices may
not meet the performance requirements.
Temperature
tL
TS MAX.
RAMP-DOWN
TS MIN.
ts
•
Compatible with Pb and Pb-free solder reflow profiles.
•
Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse® Polymer PTC Soldering
Recommendation guidelines.
•
Designed for single solder reflow operations.
PREHEAT
25
8 MINS.
t 25 *C TO PEAK
Time
Profile Feature
Average Ramp-Up Rate (TSmax to Tp)
3 °C / second max.
Pb-Free Assembly
PREHEAT:
Temperature Min. (TSmin)
Temperature Max. (TSmax)
Time (tsmin to tsmax)
150 °C
200 °C
60~180 seconds
Process
TIME MAINTAINED
ABOVE: Materials
Description
Temperature (TL)
Time (tL)
Temperature
Time
Interval
217 °C
60~150 seconds
Peak / Classification Temperature (TP)
260 °C
Time within 5 °C of Actual Peak Temperature (tp)
20~40 seconds
Ramp-Down Rate
6 °C / second max.
Time within 25 °C to Peak Temperature
8 minutes max.
How to Order
Typical Part Marking
MF - NSML 200 - 2
Multifuse® Product
Designator
Series
NSML = 1206 Low Ohmic
Surface Mount Component
Hold Current, Ihold
150 - 400 (1.50 Amps - 4.00 Amps)
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Represents total content. Layout may vary.
NJ
PART IDENTIFICATION:
MF-NSML150 = NG
MF-NSML175 = NH
MF-NSML190 = NI
MF-NSML200 = NJ
MF-NSML260 = NN
MF-NSML300 = NP
MF-NSML350 = NS
MF-NSML380 = NV
MF-NSML400 = NU
MANUFACTURING DATE CODE IS
LOCATED ON PACKING LABEL.
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
EMEA:
Tel: +36 88 520 390
Fax: +36 88 520 211
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
MF-NSML SERIES, REV. E, 07/15
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-NSML Series - Low Ohmic PTC Resettable Fuses
MF-NSML Series
per EIA 481-2
12.0 ± 0.30
(0.472 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
1.90 ± 0.10
(0.075 ± 0.004)
3.50 ± 0.10
(0.138 ± 0.004)
4.5
(0.177)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.216 + 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
0.65 ± 0.10
(0.026 ± 0.004)
390
(15.35)
160
(6.30)
Tape Dimensions
W
P0
P1
P2
A0
B0
B1 max.
D0
F
E1
E2 typ.
T max.
T1 max.
K0
Leader min.
Trailer min.
Reel Dimensions
185
(7.283)
50
(1.97)
12.4 + 1/-0
(0.488 + 0.039/-0)
15.4
(0.606)
A max.
N min.
W1
W2 max.
DIMENSIONS:
P0
T
D0
P2
E1
MM
(INCHES)
W2(MEASURED
AT HUB)
COVER
TAPE
F
E2 W
B1
A
N(HUB DIA.)
B0
K0
T1
P1
A0
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
W1(MEASURED
AT HUB)