CO LO & MP LI GE AN N T FR EE Features Applications ■ Surface mount packaging for automated ■ Thermal protection for Li-ion and polymer ** HA *R oH S ■ ■ ■ ■ assembly Small footprint size (1210) and low profile for space-constrained mobile applications Ultra-low resistance RoHS compliant* and halogen free** Agency recognition: battery packs ■ Game consoles ■ PC motherboards ■ USB port protection - USB 2.0, 3.0 & OTG ■ Mobile phones ■ Digital cameras MF-USML Series - Low Ohmic PTC Resettable Fuses Electrical Characteristics Ihold V max. Volts I max. Amps MF-USML175 MF-USML190 MF-USML200 6 6 6 MF-USML230 MF-USML250 MF-USML270 MF-USML300 MF-USML350 MF-USML380 MF-USML400 6 6 6 6 6 6 6 Model Itrip Resistance 50 50 50 Amperes at 23 °C Hold Trip 1.75 3.50 1.90 4.90 2.00 4.00 Ohms at 23 °C RMin. R1Max. 0.0060 0.0400 0.0060 0.0300 0.0050 0.0240 50 50 50 50 50 50 50 2.30 2.50 2.70 3.00 3.50 3.80 4.00 0.0045 0.0045 0.0040 0.0040 0.0030 0.0020 0.0015 4.60 5.00 5.40 6.00 7.00 8.00 8.00 0.0240 0.0220 0.0200 0.0180 0.0180 0.0160 0.0155 Amperes at 23 °C Seconds at 23 °C 8.00 9.50 8.00 2.50 3.00 3.00 Tripped Power Dissipation Watts at 23 °C Typ. 0.8 0.8 0.8 8.00 8.00 8.00 8.00 17.50 19.00 20.00 3.50 3.50 4.00 4.00 2.00 2.00 2.00 0.8 0.8 0.8 0.8 0.8 0.8 0.8 Max. Time To Trip Environmental Characteristics Operating Temperature......................................... -40 °C to +85 °C Maximum Device Surface Temperature in Tripped State .................................................... 125 °C Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±10 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change (Rmin<R<R1max) Condition A Test Procedures And Requirements For Model MF-USML Series Test Test Conditions Accept/Reject Criteria Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage cUL File Number ................................................... E174545 http://www.ul.com/ Follow link to Certifications, then cUL File No., enter E174545 TÜV Certificate Number ....................................... R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. *Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USML Series - Low Ohmic PTC Resettable Fuses Product Dimensions Model MF-USML175 MF-USML190 MF-USML200 MF-USML230 MF-USML250 MF-USML270 MF-USML300 MF-USML350 MF-USML380 MF-USML400 Min. 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) A Max. 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) Min. 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) Max. 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) Max. 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) D Min. 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) Min. 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) Max. 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 3.00 (0.118) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) 0.60 (0.024) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) 0.05 (0.002) 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 0.45 (0.018) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) B C Packaging: 5000 pcs. per reel. Side View Top View A C E MM (INCHES) DIMENSIONS: Bottom View D Recommended Pad Layout E 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) 2.5 ± 0.1 (.098 ± .004) B 2.0 ± 0.1 (.079 ± .004) Terminal material: ENIG-plated terminals (Tin-plated terminals available upon request). Termination pad solderability: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. Thermal Derating Chart - Ihold (Amps) Model Ambient Operating Temperature 23 °C 40 °C 50 °C 1.75 1.49 1.34 MF-USML175 -40 °C 2.57 -20 °C 2.33 0 °C 2.07 60 °C 1.24 70 °C 1.00 85 °C 0.91 MF-USML190 2.89 2.58 2.25 1.90 1.54 MF-USML200 3.26 2.87 2.50 2.00 1.70 1.36 1.21 0.94 0.77 1.48 1.29 1.09 0.78 MF-USML230 3.55 3.17 2.78 2.30 MF-USML250 3.70 3.35 2.95 2.50 1.94 1.72 1.55 1.27 1.06 2.10 1.90 1.75 1.40 1.30 MF-USML270 3.98 3.60 3.18 MF-USML300 4.41 3.99 3.54 2.70 2.28 2.03 1.90 1.52 1.40 3.00 2.55 2.30 2.13 1.71 1.56 MF-USML350 5.00 4.60 MF-USML380 6.00 5.28 4.05 3.50 2.80 2.40 2.00 1.60 1.00 4.52 3.80 3.15 2.65 2.39 2.09 1.60 MF-USML400 5.71 5.26 4.63 4.00 3.20 2.70 2.29 2.00 1.37 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USML Series - Low Ohmic PTC Resettable Fuses Solder Reflow Recommendations Notes: tp TP CRITICAL ZONE T L TO TP RAMP-UP TL • MF-USML models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. • All temperatures refer to topside of the package, measured on the package body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Temperature tL TS MAX. RAMP-DOWN TS MIN. ts • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC Soldering Recommendation guidelines. • Designed for single solder reflow operations. PREHEAT 25 8 MINS. t 25 *C TO PEAK Time Profile Feature Average Ramp-Up Rate (TSmax to Tp) 3 °C / second max. Pb-Free Assembly PREHEAT: Temperature Min. (TSmin) Temperature Max. (TSmax) Time (tsmin to tsmax) 150 °C 200 °C 60~180 seconds Process TIME MAINTAINED ABOVE: Materials Description Temperature (TL) Time (tL) Temperature Time Interval 217 °C 60~150 seconds Peak / Classification Temperature (TP) 260 °C Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds Ramp-Down Rate 6 °C / second max. Time within 25 °C to Peak Temperature 8 minutes max. How to Order Typical Part Marking MF - USML 175 - 2 Represents total content. Layout may vary. ® Multifuse Product Designator Series USML = 1210 Low-Ohmic Surface Mount Component Hold Current, Ihold 175 - 400 (1.75 - 400 Amps) Packaging Packaged per EIA 481-1 -2 = Tape and Reel U30 PART IDENTIFICATION: MF-USML175 = U17 MF-USML190 = U19 MF-USML200 = U20 MF-USML230 = U23 MF-USML250 = U25 MF-USML270 = U27 MF-USML300 = U30 MF-USML350 = U35 MF-USML380 = U38 MF-USML400 = U40 MANUFACTURING DATE CODE IS LOCATED ON PACKING LABEL. Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com MF-USML SERIES, REV. E, 07/15 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USML Series - Low Ohmic PTC Resettable Fuses MF-USML Series per EIA 481-2 12.0 ± 0.3 (0.472 ± 0.012) 4.0 ± 0.1 (0.157 ± 0.004) 4.0 ± 0.1 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 2.9 ± 0.10 (0.114 ± 0.004) 3.50 ± 0.10 (0.138 ± 0.004) 4.5 (0.177) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.216 + 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 0.65 ± 0.10 (0.026 ± 0.004) 390 (15.35) 160 (6.30) Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 typ. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions 185 (7.283) 50 (1.97) 12.4 + 1/-0 (0.488 + 0.039/-0) 15.4 (0.606) A max. N min. W1 W2 max. DIMENSIONS: P0 T D0 P2 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. W1(MEASURED AT HUB)