*R & oHS AE C C OM AP P PR LI OV AN ED T Features ■ Compliant with AEC-Q200 Rev-C- Stress ■ RoHS compliant* and halogen free** Test Qualification for Passive Components in Automotive Applications ■ Fast tripping resettable circuit protection ■ Surface mount packaging for automated assembly ■ Small footprint size (1210) ■ Agency recognition: MF-USMF Series - PTC Resettable Fuses Electrical Characteristics Ihold Model MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150 MF-USMF175X V max. Volts I max. Amps 30 30 30 6 13.2 6 6 6 6 10 10 10 40 40 40 40 40 40 Itrip Amperes at 23 °C Hold Trip 0.05 0.15 0.10 0.30 0.20 0.40 0.35 0.75 0.50 1.00 0.75 1.50 1.10 2.20 1.50 3.00 1.75 3.50 Resistance Ohms at 23 °C RMin. R1Max. 2.800 50.000 0.800 15.000 0.400 5.000 0.200 1.300 0.180 0.900 0.070 0.450 0.050 0.210 0.030 0.110 0.020 0.090 Max. Time To Trip Amperes at 23 °C Seconds at 23 °C 0.25 0.50 8.00 8.00 8.00 8.00 5.00 5.00 8.00 1.50 0.60 0.02 0.20 0.10 0.10 1.00 5.00 1.00 Tripped Power Dissipation Watts at 23 °C Typ. 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.7 Environmental Characteristics Operating Temperature......................................... -40 °C to +85 °C Maximum Device Surface Temperature in Tripped State .................................................... 125 °C Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change Condition A Test Procedures And Requirements For Model MF-USMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage UL File Number ..................................................... E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 TÜV Certificate Number ....................................... R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213 * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. ** Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Applications ■ Game consoles ■ PC motherboards ■ USB port protection - USB 2.0, 3.0 & OTG ■ HDMI 1.4 Source protection ■ IEEE 1394 ports ■ Mobile phones ■ Digital cameras MF-USMF Series - PTC Resettable Fuses Product Dimensions A Model Min. 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150 3.00 (0.118) MF-USMF175X Max. 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) Min. 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) B Max. 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) Min. 0.80 (0.031) 0.80 (0.031) 0.80 (0.031) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) C Max. 1.1 (0.043) 1.1 (0.043) 1.1 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 3.43 (0.135) 3.43 (0.135) 2.35 (0.093) 2.35 (0.093) 2.80 (0.110) 2.80 (0.110) 0.40 (0.016) 0.40 (0.016) 0.85 (0.033) 0.85 (0.033) 0.30 (0.012) 0.30 (0.012) Packaging: 3000 pcs. per reel. Top and Bottom View A DIMENSIONS: Side View Recommended Pad Layout C 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) 2.5 ± 0.1 (.098 ± .004) B 2.0 ± 0.1 (.079 ± .004) MM (INCHES) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. D Solder Reflow Recommendations 300 Preheating Soldering Cooling Notes: Temperature (°C) 250 200 150 100 • MF-USMF models cannot be wave soldered. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC Soldering Recommendation guidelines. 50 0 160–220 10–20 120 Time (seconds) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USMF Series - PTC Resettable Fuses Thermal Derating Chart - Ihold (Amps) Model Ambient Operating Temperature 23 ˚C 40 ˚C 50 ˚C 0.05 0.04 0.04 MF-USMF005 -40 ˚C 0.08 -20 ˚C 0.07 0 ˚C 0.06 60 ˚C 0.03 70 ˚C 0.03 85 ˚C 0.02 MF-USMF010 0.15 0.13 0.12 0.10 0.09 0.08 0.07 0.06 0.05 MF-USMF020 0.32 0.28 0.24 0.20 MF-USMF035 0.51 0.46 0.40 0.34 0.18 0.16 0.14 0.12 0.10 0.30 0.27 0.24 0.22 0.18 MF-USMF050 0.76 0.66 0.58 MF-USMF075 1.10 0.97 0.86 0.48 0.42 0.38 0.35 0.29 0.23 0.72 0.64 0.58 0.55 0.47 0.39 MF-USMF110 1.60 1.42 MF-USMF150 2.30 2.02 1.26 1.10 0.94 0.86 0.80 0.70 0.58 1.76 1.43 1.24 1.11 1.00 0.85 0.65 MF-USMF175X 2.80 2.45 2.10 1.75 1.55 1.45 1.35 1.25 1.10 Typical Time to Trip at 23 ˚C How to Order MF - USMF 010 X - 2 100 MF-USMF075 MF-USMF020 MF-USMF035 MF-USMF010 Time to Trip (Seconds) 10 Multifuse® Product Designator Series USMF = 1210 Surface Mount Component Hold Current, Ihold 005-175 (0.05-1.75 Amps) Multifuse® freeXpansion™ Design Packaging Packaged per EIA 481-1 -2 = Tape and Reel MF-USMF110 MF-USMF150 MF-USMF050 MF-USMF175X 1 MF-USMF005 0.1 Typical Part Marking 0.01 Represents total content. Layout may vary. 0.001 0.1 1 10 100 UNDERSCORE SIGNIFIES HALOGEN FREE COMPLIANCE Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. 6 A PART IDENTIFICATION: MF-USMF005 = 0 MF-USMF010 = 1 MF-USMF020 = 2 MF-USMF035 = 3 MF-USMF050 = 4 MF-USMF075 = 5 MF-USMF110 = 6 MF-USMF150 = 8 MF-USMF175X = 9 BIWEEKLY DATE CODE: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z MF-USMF SERIES, REV. P, 08/15 “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USMF Series Tape and Reel Specifications MF-USMF Series per EIA 481-2 8.0 ± 0.3 (0.315 ± 0.012) 4.0 ± 0.1 (0.157 ± 0.004) 4.0 ± 0.1 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 2.76 ± 0.10 (0.109 ± 0.004) 3.50 ± 0.10 (0.138 ± 0.004) 4.35 (0.171) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 3.5 ± 0.05 (0.138 + 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 6.25 (0.246) 0.6 (0.024) 0.1 (0.004) 1.07 ± 0.10 (0.042 ± 0.004) 390 (15.35) 160 (6.30) Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions 185 (7.283) 50 (1.97) 8.4 + 1.5/ -0.0 (0.331 + 0.059/-0) 14.4 (0.567) A max. N min. W1 W2 max. DIMENSIONS: T D0 P2 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. W1(MEASURED AT HUB)