TBU PL

T
PL
IA
N
M
CO
*R
oH
S
Features
Applications
■ Superior circuit protection
■ SLIC protection
■ Overcurrent & overvoltage protection
■ Cable & DSL
■ Blocks surges up to rated limits
■ MDU/MTU modems
■ High-speed performance
■ ONT
■ Small SMT package
■ Voice/DSL line cards
■ RoHS compliant*
■ Agency recognition:
TBU-PL Series - TBU® High-Speed Protectors
General Information
Vdd
The TBU-PL Series of Bourns® TBU® products are low capacitance dual bidirectional high-speed protection
components, constructed using MOSFET semiconductor technology, and designed to protect against faults
caused by short circuits, AC power cross, induction and lightning surges.
In addition to overcurrent protection, an added feature is the voltage monitoring on the two lines. If the voltage
on the line drops below Vss then the voltage will trigger the device to switch to the blocking state.
Line 1 SLIC
Line 1
Line 2 SLIC
Line 2
The TBU® high-speed protector placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics will not be exposed to
large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package
and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles.
Agency Approval
UL
Description
File Number: E315805
Vss
TBU ® Device
Industry Standards (in Conjunction with OVP Device)
Solutions available for GR-1089-CORE, ITU-T and a combination of both.
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Parameter
Vimp
Peak impulse voltage withstand with duration less than 10 ms
Vrms
Continuous A.C. RMS voltage
Top
Tstg
Tjmax
ESD
Operating temperature range
Storage temperature range
Maximum Junction Temperature
HBM ESD Protection per IEC 61000-4-2 on line pads
Part Number
TBU-PL050-xxx-WH
TBU-PL060-xxx-WH
TBU-PL075-xxx-WH
TBU-PL085-xxx-WH
TBU-PL050-xxx-WH
TBU-PL060-xxx-WH
TBU-PL075-xxx-WH
TBU-PL085-xxx-WH
Value
500
600
750
850
300
350
400
425
-55 to +125
-65 to +150
+125
±2
Unit
V
V
°C
°C
°C
kV
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Itrigger
Rdevice
Rmatch
tblock
IQ
Iss
Vreset
Vto
Vss
Rth(j-l)
Rth(j-l)
Rth(j-l)
Rth(j-l)
Parameter
Part Number
Current required for the device to go from
TBU-PLxxx-100-WH
operating state to protected state
TBU-PLxxx-200-WH
Series resistance of the TBU® device
Package resistance matching of the TBU® device #1 - TBU® device #2
Time taken for the device to go into current limiting
Current through the triggered TBU® device with 50 Vdc circuit voltage
Operating current with Vss = -50 V
Forward Mode
TBU-PLxxx-100-WH
®
Reverse Mode
Voltage below which the triggered TBU
device will transition to normal operating state
Forward Mode
TBU-PLxxx-200-WH
Reverse Mode
Voltage threshold offset with 60 Hz applied voltage, with Vss -50 V (Vss - VlineSLIC)
Operating voltage range relative to Vdd
One side junction to package pads - FR4 using minimum recommended pad layout
Both sides junction to package pads - FR4 using minimum recommended pad layout
One side junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2)
Both sides junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2)
Min.
100
200
40
Typ.
150
300
50
±0.5
0.25
0.70
100
15
13
20
17
12
10
15
12
-1.0
-180
110
65
70
40
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Max.
200
400
55
±1.0
1
1.50
22
20
25
22
0.2
-20
Unit
mA
Ω
Ω
µs
mA
µA
V
V
V
°C/W
°C/W
°C/W
°C/W
TBU-PL Series - TBU® High-Speed Protectors
Functional Block Diagram
HIGH
VOLTAGE
SWITCH
Line 1 SLIC
Line 1
CURRENT
SENSE
Vdd
+
VOLTAGE
COMPARATOR
Vss
Vdd
Vss
Vdd
VOLTAGE
COMPARATOR
Vss
+
CURRENT
SENSE
HIGH
VOLTAGE
SWITCH
Line 2 SLIC
Reference Application
Line 2
Basic TBU Operation
The TBU-PL Series are high-speed protectors used in voice/
VoIP SLIC applications.The maximum voltage rating of the TBU®
device should never be exceeded. Where necessary, an OVP
device should be employed to limit the maximum voltage. A costeffective protection solution combines Bourns® TBU® protection
devices with a pair of Bourns® MOVs. For bandwidth sensitive
applications, a Bourns® GDT may be substituted for the MOV. If
EN55024 EMC compliance is required, the TBU® device
may require capacitors to be fitted between the Tip and Ring
connections and ground.
The TBU® device, constructed using MOSFET semiconductor
technology, placed in the system circuit will monitor the
current with the MOSFET detection circuit triggering to provide
an effective barrier behind which sensitive electronics are not
exposed to large voltages or currents during surge events. The
TBU® device operates in approximately 1 µs - once line current
exceeds the TBU® device’s trigger current Itrigger. When
operated, the TBU® device restricts line current to less than
1 mA typically. When operated, the TBU® device will block all
voltages including the surge up to rated limits.
GND
When the voltage on the SLIC output is driven below
(Vbat – Vto) the TBU-PL series device switches to the
blocking state, regardless of output current in the device.
Vdd
Line 1
Line 1
SLIC
After the surge, the TBU® device resets when the voltage
across the TBU® device falls to the Vreset level. The TBU®
device will automatically reset on lines which have no DC bias
or have DC bias below Vreset (such as unpowered signal lines).
MOV
TBU®
Device
Line 2
SLIC
Vss
MOV
Line 2
If the line has a normal DC bias above Vreset, the voltage
across the TBU® device may not fall below Vreset after the
surge. In such cases, special care needs to be taken to ensure
that the TBU® device will reset, with software monitoring as one
method used to accomplish this. Bourns application
engineers can provide further assistance.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-PL Series - TBU® High-Speed Protectors
Bourns® TBU® Device Solutions
Industry Standard
Telcordia GR-1089-CORE
Intra-building
Port Type 4
Telcordia GR-1089-CORE
Intra-building
Port Type 4a
Non-GR-1089-CORE Intra-building
Specifications
ITU-T Basic K.20, K.21, K.45
ITU-T Enhanced K.20, K.21, K.45
Surge & AC Withstand
TBU® Device P/N
1500 V, 100 A 2/10 µs
120 Vrms, 25 A, 900 s
TBU-PL050-200-WH
1
MOV-07D201K
2
1000 V, 100 A 10/1000 µs
120 Vrms, 25 A, 900 s
TBU-PL060-200-WH
1
MOV-10D201K
2
TBU-PL085-200-WH
1
MOV-10D361K
2
TBU-PL085-200-WH
1
MOV-10D431K
2
TBU-PL075-200-WH
1
MOV-10D361K
2
TBU-PL060-200-WH
1
TISP4400M3BJ
2
TBU-PL085-200-WH
1
MOV-10D391K
2
TBU-PL060-200-WH
1
TISP4500H3BJ
2
5000 V, 500 A 2/10 µs
230 Vrms, 25 A, 900 s
1500 V, 100 A 2/10 µs
275 Vrms, 25 A, 900 s
4000 V, 40 Ω 10/700 µs
230 Vrms 10 Ω - 1000 Ω, 900 s
600 Vrms 600 Ω, 0.2 s
4000 V, 40 Ω 10/700 µs
230 V rms 10 Ω -1000 Ω, 900 s
600 V rms 600 Ω, 0.1 s
6000 V, 40 Ω 10/700 µs
240 Vrms 10 Ω - 1000 Ω, 900 s
600 Vrms 600 Ω, 0.2 s
600 Vrms 600 Ω, 1 s*
1500 Vrms, 200 Ω, 2 s*
6000 V, 40 Ω 10/700 µs
240 Vrms 10 Ω - 1000 Ω, 900 s
600 Vrms 600 Ω, 1 s
1500 Vrms, 200 Ω, 2 s
Qty.
OVP Device P/N
Qty.
* GDT Special Test Protector with DC breakdown (DCBD) of less than 330 V.
Notes:
1) The MOV maximum continuous rms voltage rating should not be exceeded. The exception is where the data sheet highlights withstand
capability such as the 600 Vrms, 1 A for 0.2 s, for example.
2) If EN55024 EMC compliance is required, the TBU® device may require capacitors to be fitted between the Tip and Ring connections and
ground (i.e. in parallel with the MOV device). The capacitance value can be chosen to meet levels as follows:
• 10 nF for EN55024 Level 1
• 20 nF for EN55024 Level 2
• 47 nF for EN55024 Level 3
Selection of capacitor voltage rating depends upon TBU® part number selection. Recommendations include:
• TBU-PL050 & TBU-PL060 Series: 120 VAC, 500 V Peak Surge Rated
• TBU-PL075 & TBU-PL085 Series: 240 VAC, 750 V Peak Surge Rated
Depending upon the SLIC type, it is usually possible to remove any EMI capacitors present between the output of the SLIC and ground
when using capacitors C1 and C2 in parallel with the MOVs.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-PL Series - TBU® High-Speed Protectors
Performance Graphs
Typical Trigger Current vs. Temperature
Typical V-I Characteristics (TBU-PL085-200-WH)
CURRENT
(50 mA/div)
Normalized Trigger Current (A)
1.8
ITRIP
VRESET
VOLTAGE
(5 V/div)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25
0
25
50
75 100 125
Junction Temperature (°C)
Typical Resistance vs. Temperature
Tracking Voltage Characteristics
2.2
Vbat range of -25 V to -150 V
Normalized Resistance (Ω)
100
Resistance ( )
90
80
70
60
50
40
-4
-3
-2
-1
0
1
2
3
4
Voltage threshold offset (V)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25
0
25
50
75 100 125
Junction Temperature (°C)
Typical Surge Response
Power Derating Curve
3.0
Total Max. Power (W)
Voltage: 100 V/div
One Side, No PCB Cu
One Side, 0.5 sq. in. PCB Cu
Two Sides, No PCB Cu
Two Sides, 0.5 sq. in. PCB Cu
2.5
2.0
Time: 250 ns/div
1.5
Current: 100 mA/div
1.0
0.5
0.0
20
40
60
80
100
Junction Temperature (°C)
120
140
(TBU-PL050-100-WH with MOV-07D201K
Using 1800 V 1.2/50 ms Surge Pulse)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-PL Series - TBU® High-Speed Protectors
Product Dimensions
0.70
(.028)
0.725
(.029)
0.825
(.032)
0.40
(.016)
0.825
(.032)
6.50 ± 0.10
(.256 ± .004)
1.335
(.053)
0.30
(.012)
1.15
(.045)
0.30
(.012)
1.35
(.053)
1.20
(.047)
1.35
(.053)
1.275
(.050)
0.85
(.033)
0.85
(.033)
0.73
(.029)
XXXXX
YWWLL
4.00 ± 0.10
(.157 ± .004)
1.275
(.050)
1.20
(.047)
0.85
(.033)
0.85
(.033)
PIN 1 & BACKSIDE CHAMFER
A=
0.80 - 1.00
(.031 - .039)
1.335
(.053)
0.75
(.030)
0.85
(.033)
1.30
(.051)
0.70
(.028)
0.90
(.035)
0.85
(.033)
1.275
(.050)
0.25
C
PIN 1
(.010)
1.25
(.049)
0.75
(.030)
0.40
(.016)
A1 = 0.00 - 0.05 SEATING PLANE
(.000 - .002)
DIMENSIONS:
MM
(INCHES)
0.75
(.030)
Recommended Pad Layout
TBU® High-Speed Protectors have a 100 % matte-tin termination
finish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be defined by a solder mask
which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimension as
the TBU® pads but if smaller solder pads are used, they should be
centered on the TBU® package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
Solder pad areas should not be larger than the TBU® pad sizes
to ensure adequate clearance is maintained. The recommended
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
opening size 0.025 mm (0.0010 in.) less than the solder pad
size. Extended copper areas beyond the solder pad significantly
improve the junction to ambient thermal resistance, resulting in
operation at lower junction temperatures with a corresponding
benefit of reliability. All pads should soldered to the PCB, including pads marked as NC or NU but no electrical connection should
be made to these pads. For minimum parasitic capacitance, it is
recommended that signal, ground or power signals are not routed
beneath any pad.
Thermal Resistance vs Additional PCB Cu Area
1
7
2
6
5
120
3
4
100
Dark grey areas show added PCB copper area for better
thermal resistance.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in
different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Thermal Resistance (°C/W)
8
Power in One Side of TBU® Device
Total Power in Both Sides of TBU® Device
80
60
40
20
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Added Cu Area (Sq. In.)
1.6
1.8
2.0
®
3312Series
- 2 mm
SMD
Trimming Potentiometer
TBU-PL
- TBU
High-Speed
Protectors
Reflow Profile
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
How to Order
Typical Part Marking
TBU - PL 085 - 100 - WH
MANUFACTURER’S
TRADEMARK
TBU® Product
Series
PL = Dual Bidirectional Series
XXXXX
YWWLL
Impulse Voltage Rating
050 = 500 V
060 = 600 V
075 = 750 V
085 = 850 V
5 DIGIT PRODUCT CODE:
• 1ST ALPHA CHARACTER INDICATES PRODUCT FAMILY:
L = TBU-PL SERIES
• 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE.
• 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT.
PIN 1
MANUFACTURING
DATE CODE:
• 1ST DIGIT INDICATES THE YEAR.
• 2ND & 3RD DIGITS INDICATE THE WEEK NUMBER.
• 4TH & 5TH DIGITS INDICATE LOT CODE.
Trigger Current
100 = 100 mA
200 = 200 mA
Hold to Trip Ratio Suffix
W = Hold to Trip Ratio
Package Suffix
H = DFN Package
Device Pin Out
Pad Designation
5
8
4
1
Pin Out
Pad #
1
Line 1
5
Line 2 SLIC
2
Vdd (SLIC Ground or 0 V)
6
3
Not Used
7
Vss (SLIC Negative Supply or -Vbat)
Not Used
4
Line 1 SLIC
8
Line 2
Pad #
Pin Out
2
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
3312 - Series
2 mm SMD
Potentiometer
TBU-PL
- TBU®Trimming
High-Speed
Protectors
Packaging Specifications
P0
E
D
t
B
P2
TOP
COVER
TAPE
A
N
F
W
C
D
B0
K0
CENTER
LINES OF
CAVITY
A0
P
D1
EMBOSSMENT
G (MEASURED AT HUB)
USER DIRECTION OF FEED
QUANTITY: 3000 PIECES PER REEL
A
Min.
326
(12.835)
B
Max.
330
(13.002)
Min.
1.5
(.059)
A0
Min.
4.30
(.169)
B0
Max.
4.50
(.177)
Min.
6.70
(.264)
K0
Min.
1.0
(.039)
C
Max.
2.5
(.098)
Min.
7.9
(.311)
D
Max.
13.5
(.531)
D
Max.
6.90
(.272)
Min.
1.5
(.059)
P
Max.
1.2
(.047)
Min.
12.8
(.504)
Min.
1.5
(.059)
Min.
3.9
(.159)
E
Max.
-
Min.
1.65
(.065)
P2
Max.
4.1
(.161)
Min.
1.9
(.075)
G
Ref.
16.5
(.650)
Max.
D1
Max.
1.6
(.063)
P0
Max.
8.1
(.319)
Min.
20.2
(.795)
F
Max.
1.85
(.073)
Min.
7.4
(.291)
Max.
0.35
(.014)
Min.
15.7
(.618)
t
Max.
2.1
(.083)
Min.
0.25
(.010)
N
Ref.
102
(4.016)
max.
7.6
(.299)
W
DIMENSIONS:
Max.
16.3
(.642)
MM
(INCHES)
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. 09/15
“TBU” is a registered trademark of Bourns, Inc. in the United States and other countries, except Japan. All references to TBU® in this document for use in Japan shall be deemed to be
replaced with Bourns® TBU™.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.