PL IA N T Features CO M ■ Formerly The C650 & C850 Series are currently available, but not recommended for new designs. Bourns® TBU-CA Series is preferred. brand *R oH S ■ Extremely high speed performance ■ Blocks high voltages and currents ■ Very high bandwidth; GHz compatible ■ Small package, minimal PCB area ■ Simple, superior circuit protection ■ RoHS compliant*, UL Recognized C650 and C850 Series TBU® High-Speed Protectors Transient Blocking Units - TBU® Devices Bourns® C650 and C850 series products are high-speed bidirectional protection components, constructed using MOSFET semiconductor technology, designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. Agency Approval UL recognized component File # E315805. Industry Standards Description Model C650 C850 ® The TBU high-speed protector, triggering as a function of the MOSFET, blocks surges and provides an effective barrier behind which sensitive electronics are not exposed to large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles. GR-1089 Port Type 1, 3, 5 Telcordia ITU-T GR-974 C650 C850 K.20, K.20E, K.21, K.21E, K.45 C850 Absolute Maximum Ratings (Tamb = 25 °C) Symbol Parameter Value Unit Vimp Maximum protection voltage for impulse faults with rise time ≥ 1 µsec C650-xxx-WH C850-xxx-WH 650 850 V Vrms Maximum protection voltage for continuous Vrms faults C650-xxx-WH C850-xxx-WH 300 425 V Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -65 to +150 °C Electrical Characteristics (Tamb = 25 °C) Symbol Parameter Min. Typ. Max. Unit 100 180 260 mA Iop Maximum current through the device that will not cause current blocking Cx50-100-WH Cx50-180-WH Cx50-260-WH Itrigger Typical current for the device to go from normal operating state to protected state Cx50-100-WH Cx50-180-WH Cx50-260-WH Iout Maximum current through the device Cx50-100-WH Cx50-180-WH Cx50-260-WH Rdevice Series resistance of the TBU® device C650-100-WH C650-180-WH C650-260-WH C850-100-WH C850-180-WH C850-260-WH tblock Maximum time for the device to go from normal operating state to protected state Iquiescent Current through the triggered TBU® device with 50 Vdc circuit voltage 1 mA Vreset Voltage below which the triggered TBU® device will transition to normal operating state 14 V 150 220 330 12 8 8 17 11 11 C650 and C850 TBU® High-Speed Protectors are bidirectional; specifications are valid in both directions. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. mA 200 360 520 mA 14.5 10 10 19 14 14 Ω 1 µs Applications ■ Combo voice / xDSL linecards ■ Voice linecards ■ MDF, primary protection modules ■ Process control equipment ■ Test and measurement equipment ■ General electronics C650 and C850 Series TBU® High-Speed Protectors Typical Performance Characteristics Time to Block vs. Fault Current V-I Characteristics 1 +I Itrigger -Vreset +V Vreset Time to Block (sec) 0.1 0.01 0.001 0.0001 0.00001 0.000001 0.0000001 0.1 1 10 Fault Current (A ) -Itrigger Current vs. Temperature 140 % of Current 120 100 80 60 40 20 -40 -20 0 20 40 60 80 Temperature (°C) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 100 1000 C650 and C850 Series TBU® High-Speed Protectors Operational Characteristics The graphs below demonstrate the operational characteristics of the TBU® protector. For each graph the fault voltage, protected side voltage, and current is presented. V2 V1 TEST CONFIGURATION DIAGRAM C650 Lightning, 650 V Load C850 Lightning, 850 V 400 mA/div. 2 3 100 V/div. 400 mA/div. 100 V/div. 3 2 1 1 1 µs/div. Ch1 V1 Ch2 V2 Ch1 V1 Ch3 Current C650 Power Fault, 300 Vrms, 100 A 1 µs/div. Ch2 V2 Ch3 Current C850 Power Fault, 425 Vrms, 100 A 3 3 2 200 mA/div. 100 V/div. 100 V/div. 200 mA/div. 2 1 1 4 ms/div. 4 ms/div. Ch1 V1 Ch2 V2 Ch3 Current Ch1 V1 Ch2 V2 Ch3 Current Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. C650 and C850 Series TBU® High-Speed Protectors Product Dimensions J B H D A E 3 XXXXX YWWLL C Dim. J H 2 D K A A1 1 B F C PIN 1 A1 TOP VIEW SEATING PLANE SIDE VIEW K BOTTOM VIEW E F Recommended Pad Layout 0.70 (.028) 1.15 (.045) 2.625 (.103) 3.55 (.140) D H Pad Designation Pad # Apply 1 In/Out 2 NC 3 In/Out J K Min. Typ. Max. 0.80 (.031) 0.00 (.000) 8.15 (.321) 3.90 (.154) 2.55 (.100) 1.10 (.043) 3.45 (.136) 0.20 (.008) 0.65 (.026) 0.20 (.008) 0.90 (.035) 0.025 (.001) 8.25 (.325) 4.00 (.157) 2.60 (.102) 1.15 (.045) 3.50 (.138) 0.25 (.010) 0.70 (.028) 0.25 (.010) 1.00 (.039) 0.050 (.002) 8.35 (.329) 4.10 (.161) 2.65 (.104) 1.20 (.047) 3.55 (.140) 0.30 (.012) 0.75 (.030) 0.30 (.012) DIMENSIONS: MM (INCHES) NC = Solder to PCB; do not make electrical connection, do not connect to ground. TBU® protectors have matte-tin termination finish. Suggested layout should use non-solder mask define (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power device, it is recommended that, wherever possible, extra PCB copper area is allowed. For minimum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the pads of the device. Thermal Resistances Symbol Rth(j-a) Parameter Junction to leads (package) Value Unit 116 °C/W Reflow Profile Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5 °C of Actual Peak Temp. (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Pb-Free Assembly 3 °C/sec. max. 150 °C 200 °C 60-180 sec. 217 °C 60-150 sec. 260 °C 20-40 sec. 6 °C/sec. max. 8 min. max. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. C650 and C850 Series TBU® High-Speed Protectors How to Order Typical Part Marking C 650 - 180 - WH MANUFACTURER’S TRADEMARK Form Factor C = One TBU® protector in the device Impulse Voltage Rating 650 = 650 V 850 = 850 V 5 DIGIT PRODUCT CODE: • 1ST ALPHA CHARACTER INDICATES PRODUCT FAMILY. C = C650/C850 SERIES • 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE. • 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT. XXXXX YWWLL Iop Indicator 100 = 100 mA 180 = 180 mA 260 = 260 mA PIN 1 MANUFACTURING DATE CODE: • 1ST DIGIT INDICATES THE YEAR. • 2ND & 3RD DIGITS INDICATE THE WEEK NUMBER. • 4TH & 5TH DIGITS INDICATE LOT CODE. Packaging Specifications (per EIA468-B) P0 E D t B P2 TOP COVER TAPE A N F W C D B0 K0 CENTER LINES OF CAVITY A0 P D1 EMBOSSMENT G (MEASURED AT HUB) USER DIRECTION OF FEED QUANTITY: 3000 PIECES PER REEL A Min. Max. 326 330.25 (12.835) (13.002) Device C650, C850 Device C650, C850 Device C650, C850 A0 Min. 4.2 (.165) B0 Max. 4.4 (.173) Min. 8.45 (.333) Max. 1.3 (.051) Min. 7.9 (.311) K0 Min. 1.1 (.043) B Min. 1.5 (.059) C Max. 2.5 (.098) Min. 12.8 (.504) Max. 1.6 (.063) Min. 1.5 (.059) Max. 4.1 (.161) Min. 1.9 (.075) D Max. 8.65 (.341) Min. 1.5 (.059) Max. 8.1 (.319) Min. 3.9 (.159) P D Max. 13.5 (.531) Min. 20.2 (.795) Max. Min. 1.65 (.065) D1 P0 Max. - G Ref. 16.5 (.650) N Ref. 102 (4.016) E - P2 F Max. 1.85 (.073) Min. 7.4 (.291) Max. 0.35 (.014) Min. 15.7 (.618) t Max. 2.1 (.083) Min. 0.25 (.010) max. 7.6 (.299) W DIMENSIONS: Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Max. 16.3 (.642) MM (INCHES) C650 and C850 Series TBU® High-Speed Protectors Reference Application The C-series devices are general protectors that can be used in a variety of applications. The basic operation of the device will be demonstrated using the single line application shown in the figure below. The test circuit was subjected to a 1000 V, 10/700 µs surge waveform. The devices used were the TBU-C850-100-WH and a 2031-42T-SM-RPLF GDT (OVP) with a 10 ohm resistor for the load impedance. Line OVP TBU® Device ZLOAD General Application Circuit 900 1000 800 800 700 600 600 400 TBU® Device Current 500 200 400 0 300 -200 GDT Voltage 200 -400 100 -600 0 -800 100 TBU® Device Current (mA) Voltage Across GDT (V) The graph below shows the waveforms for the voltage across the overvoltage protector (GDT) and the current through the TBU® device. As the input line voltage increases, the current through the TBU® device increases rapidly until the trip current is reached. Due to finite reaction time for fast transients, the peak level may exceed the low frequency data sheet maximum for a very short period, typically ~100 ns. After this initial overshoot, the TBU® device will transition to the protected state, setting the current to the nominal current limiting level (~150 mA for this example). The TBU® device will then reduce the current down it to its very low quiescent level of 1 mA, typically. As the input line voltage increases to about 500 V, the GDT is triggered, reducing the input line voltage to a very low level which prevents the TBU® device from being subjected to a voltage level which exceeds its maximum rating (850 V in this example). The TBU® High-Speed Orotector and the GDT will remain in these states until the surge ends, which is about 700 µs later in this example. Only the first 4 µs of the surge are shown in the graph. For surges or AC voltages below the GDT breakover voltage, the GDT will not activate, and the TBU® device will stay in the protecting mode, blocking high voltages from the protected equipment. -1000 0 0.5 1 1.5 2 2.5 3 3.5 4 Time (µs) TBU-C850-100-WH Response to a 1000 V, 10/700 µs Surge REV. 09/15 “TBU” is a registered trademark of Bourns, Inc. in the United States and other countries. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.