BGA Package 70-Lead (15mm × 9mm × 4.92mm) (Reference LTC DWG# 05-08-1918 Rev A) A aaa Z E Y Z SEE NOTES DETAIL A A2 X 7 G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b C b1 MOLD CAP D E SUBSTRATE D F G Z // bbb Z F H1 H2 DETAIL B H J e Øb (70 PLACES) K ddd M Z X Y eee M Z L aaa Z 7 PACKAGE TOP VIEW DETAIL B PACKAGE SIDE VIEW DETAIL A 5 4 3 2 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS 3.810 2.540 1.270 0.000 0.3175 0.3175 1.270 2.540 3.810 6 PACKAGE BOTTOM VIEW 6.350 0.630 ±0.025 Ø 70x 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 4.72 0.50 4.22 0.60 0.60 0.27 3.95 NOM 4.92 0.60 4.32 0.75 0.63 15.00 9.00 1.27 12.70 7.62 0.32 4.00 MAX 5.12 0.70 4.42 0.90 0.66 0.37 4.05 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 70 NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 70 1212 REV A