BGA Package 144-Lead (15mm × 15mm × 5.01mm) (Reference LTC DWG # 05-08-1880 Rev B) D X A2 Y SEE NOTES DETAIL A Z A aaa Z G e 7 b M L b A1 ccc Z K J H b1 MOLD CAP E G F SUBSTRATE 4 E Z // bbb Z H2 PIN “A1” CORNER F H1 D DETAIL B C Øb (144 PLACES) B e A ddd M Z X Y eee M Z aaa Z 12 SEE NOTES PACKAGE TOP VIEW DETAIL B PACKAGE SIDE VIEW 11 3 10 9 8 7 6 5 4 3 2 1 PIN 1 PACKAGE BOTTOM VIEW 6.9850 5.7150 0.630 ±0.025 Ø 144x 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 SUGGESTED PCB LAYOUT TOP VIEW 2. ALL DIMENSIONS ARE IN MILLIMETERS DETAIL A 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DIMENSIONS SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 4.81 0.50 4.31 0.60 0.60 0.36 3.95 NOM 5.01 0.60 4.41 0.75 0.63 15.00 15.00 1.27 13.97 13.97 0.41 4.00 MAX 5.21 0.70 4.51 0.90 0.66 0.46 4.05 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 144 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION BGA 144 1112 REV B