UKJ Package Variation: UKJ64(58) 64(58)-Lead Plastic QFN (7mm × 11mm) (Reference LTC DWG # 05-08-1922 Rev Ø) 0.70 ±0.05 1.80 ±0.05 1.50 ±0.05 9.38 ±0.05 3.60 ±0.05 7.50 ±0.05 5.50 REF 0.45 3.83 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 9.50 REF 10.10 ±0.05 11.50 ±0.05 APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 7.00 ±0.10 PIN 1 TOP MARK (SEE NOTE 6) 0.75 ±0.05 PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER 5.50 REF 0.00 – 0.05 53 63 64 1 52 2 0.325 REF 1.50 ±0.10 44 11.00 ±0.10 11.00 ±0.10 1.20 ±0.10 9.50 REF 9.38 ±0.10 40 0.45 ±0.10 3.83 ±0.10 3.60 ±0.10 35 33 20 0.50 REF 0.40 ±0.10 0.200 REF 31 27 25 0.25 ±0.05 0.50 BSC 21 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE (UKJ64(58)) QFN 0412 REV Ø