UH Package 24-Lead Plastic QFN (5mm × 5mm) (Reference LTC DWG # 05-08-1747 Rev A) 0.75 ±0.05 5.40 ±0.05 3.90 ±0.05 3.20 ± 0.05 3.25 REF 3.20 ± 0.05 PACKAGE OUTLINE 0.30 ± 0.05 0.65 BSC RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 ± 0.10 R = 0.05 TYP 0.75 ± 0.05 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD R = 0.150 TYP 23 PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER 24 0.55 ± 0.10 PIN 1 TOP MARK (NOTE 6) 1 2 5.00 ± 0.10 3.25 REF 3.20 ± 0.10 3.20 ± 0.10 (UH24) QFN 0708 REV A 0.200 REF NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.30 ± 0.05 0.65 BSC