05-08-1747

UH Package
24-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1747 Rev A)
0.75 ±0.05
5.40 ±0.05
3.90 ±0.05
3.20 ± 0.05
3.25 REF
3.20 ± 0.05
PACKAGE OUTLINE
0.30 ± 0.05
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 ± 0.10
R = 0.05
TYP
0.75 ± 0.05
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.150
TYP
23
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 × 45°
CHAMFER
24
0.55 ± 0.10
PIN 1
TOP MARK
(NOTE 6)
1
2
5.00 ± 0.10
3.25 REF
3.20 ± 0.10
3.20 ± 0.10
(UH24) QFN 0708 REV A
0.200 REF
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.30 ± 0.05
0.65 BSC