UFE Package 16-Lead Plastic QFN (4mm × 6mm) (Reference LTC DWG # 05-08-1966 Rev A) 0.80 ±0.05 0.5 BSC 0.70 ±0.05 0.8 BSC 0.8 BSC 0.8 BSC 4.50 ±0.05 3.10 ±0.05 0.80 ±0.05 1.90 ±0.05 4.10 ±0.05 0.8 BSC 0.8 BSC 0.8 BSC 0.5 BSC PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 5.10 ±0.05 6.50 ±0.05 PIN 1 NOTCH R = 0.30 OR 0.35 × 45° CHAMFER RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.75 ±0.05 4.00 ±0.10 15 16 0.40 ±0.10 PIN 1 TOP MARK (NOTE 6) 14 0.8 BSC 1 0.50 BSC 2 0.8 BSC 4.10 ±0.10 0.8 BSC 0.80 BSC 6.00 ±0.10 0.50 BSC 0.8 BSC 0.80 BSC 0.8 BSC 1.90 ±0.10 0.50 BSC 6 9 0.200 REF 0.00 – 0.05 8 7 (UFE16) QFN 0414 REV A 0.25 ±0.05 0.80 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE