UFEMA Package 32-Lead Plastic QFN (4mm × 6mm) (Reference LTC DWG # 05-08-1938 Rev Ø) 1.0 REF 1.5 REF 0.70 ±0.05 4.50 ±0.05 3.10 ±0.05 2.70 ±0.05 2.70 ±0.05 1.40 ±0.05 2.50 REF 1.70 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 2.55 ±0.05 3.25 ±0.05 4.50 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 ±0.10 0.75 ±0.05 R = 0.125 TYP 27 32 1 26 PIN 1 TOP MARK (NOTE 6) 2.70 ±0.10 1.40 ±0.10 2.75 ±0.10 1.0 REF 4.50 REF 6.00 ±0.10 0.35 ±0.10 1.5 REF 1.70 ±0.10 2.70 ±0.10 0.28 10 0.40 ±0.10 0.200 REF 0.25 ±0.05 0.00 – 0.05 0.50 BSC 2.50 REF BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE (UFE32MA) QFN 0113 REV Ø