UFEMA Package 26-Lead Plastic QFN (4mm × 6mm) (Reference LTC DWG # 05-08-1770 Rev A) 0.70 ±0.05 4.50 ± 0.05 2.64 ± 0.05 2.64 ± 0.05 2.31 ± 0.05 3.10 ± 0.05 0.41 ± 0.05 2.18 ± 0.05 2.50 REF 2.36 ± 0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 2.55 ± 0.05 3.25 ± 0.05 4.50 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 ± 0.10 0.75 ± 0.05 PIN 1 TOP MARK (NOTE 6) PIN 1 NOTCH R = 0.30 OR 0.35 × 45° CHAMFER R = 0.10 TYP 26 25 1 2.64 ± 0.10 2.18 ± 0.10 0.41 ± 0.10 4.50 REF 6.00 ± 0.10 2 R = 0.125 TYP 0.50 BSC 2.36 ± 0.10 2.31 ± 0.10 2.64 ± 0.10 0.25 ± 0.05 0.40 ± 0.10 0.200 REF 0.00 – 0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 2.50 REF BOTTOM VIEW—EXPOSED PAD (UFE26MA) QFN 0608 REV A