LGA Package 25-Lead (6.25mm × 6.25mm × 1.82mm) (Reference LTC DWG # 05-08-1949 Rev Ø) SEE NOTES DETAIL A aaa Z E Y SEE NOTES A X 7 G PIN 1 3 A PIN “A1” CORNER b 4 MOLD CAP D B F SUBSTRATE C e D E 5 Z // bbb Z PACKAGE TOP VIEW H1 H2 aaa Z Ø eee S Z X Y 2.540 0.000 1.270 0.3175 0.3175 1.270 2.540 1 2. ALL DIMENSIONS ARE IN MILLIMETERS DETAIL A 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 1.270 0.000 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 Øb (25 PLACES) 2.540 3 PACKAGE BOTTOM VIEW DETAIL B DETAIL B 4 6. THE TOTAL NUMBER OF PADS: 25 0.3175 DIMENSIONS 0.3175 1.270 2.540 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A b D E e F G H1 H2 aaa bbb eee MIN 1.72 0.60 0.27 1.45 NOM 1.82 0.63 6.25 6.25 1.27 5.08 5.08 0.32 1.50 7 MAX 1.92 0.66 0.37 1.55 0.15 0.10 0.15 TOTAL NUMBER OF LGA PADS: 25 NOTES ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 25 0613 REV Ø