LGA Package 121-Lead (15mm × 15mm × 2.82mm) (Reference LTC DWG# 05-08-1861 Rev B) aaa Z SEE NOTES DETAIL A 15 BSC X 2.72 – 2.92 Y 11 10 9 8 7 6 5 4 3 2 7 1 A B PAD 1 CORNER C 4 D E 15 BSC 12.70 BSC MOLD CAP F SUBSTRATE G 0.27 – 0.37 H Z // bbb Z 2.45 – 2.55 J 1.27 BSC K DETAIL B L aaa Z PADS SEE NOTES PACKAGE TOP VIEW DIA (0.630) 121x 3 PACKAGE BOTTOM VIEW DETAIL B 6.350 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 0.955 1.585 eee S X Y 12.70 BSC 6.350 DETAIL A 5.080 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 3.810 2. ALL DIMENSIONS ARE IN MILLIMETERS 2.540 1.270 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 0.000 0.955 1.585 1.270 5. PRIMARY DATUM -Z- IS SEATING PLANE 2.540 6. THE TOTAL NUMBER OF PADS: 121 3.810 7 5.080 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 6.350 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 121 1212 REV B PAD 1 DIA (0.630)