LGA Package 32-Lead (11.25mm × 6.25mm × 2.82mm) (Reference LTC DWG # 05-08-1838 Rev A) aaa Z 6.25 BSC Y PADS SEE NOTES 2.72 – 2.92 X SEE NOTES DETAIL A 5.08 BSC 7 3 A 0.605 – 0.665 PAD 1 CORNER MOLD CAP 4 11.25 BSC B SUBSTRATE C D 8.89 BSC 0.27 – 0.37 2.45 – 2.55 E Z DETAIL B bbb Z DIA (0.635) PAD 1 F 1.27 BSC G H aaa Z 5 PACKAGE TOP VIEW 0.635 ±0.025 SQ. 31x 3 2 1 DETAIL B 2.540 1.270 0.3175 0.3175 1.270 2.540 0.000 eee S X Y 4 PACKAGE BOTTOM VIEW 4.445 DETAIL A 3.175 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 1.905 2.8575 3.4925 0.635 0.000 0.635 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 1.905 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 3.175 4.445 5. PRIMARY DATUM -Z- IS SEATING PLANE SUGGESTED PCB LAYOUT TOP VIEW 6. THE TOTAL NUMBER OF PADS: 32 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 COMPONENT PIN “A1” TRAY PIN 1 BEVEL LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 32 0113 REV A