05-08-1890

BGA Package
170-Lead (15.00mm × 9.00mm × 1.54mm)
(Reference LTC DWG# 05-08-1890 Rev B)
A
aaa Z
E
Y
A2
X
Z
SEE NOTES
DETAIL A
SEE NOTES
10
9
8
7
6
5
4
3
2
7
1
PIN 1
3
A
A1
PIN “A1”
CORNER
B
ccc Z
C
4
b
D
E
b1
MOLD
CAP
F
SUBSTRATE
// bbb Z
H
F
Z
H2
D
G
H1
J
DETAIL B
K
L
M
e
Øb (170 PLACES)
N
ddd M Z X Y
eee M Z
P
Q
R
S
aaa Z
3.60
2.80
2.00
1.20
0.40
0.00
0.40
1.20
2.55
4.80
4.00
3.20
2.40
1.60
0.80
0.00
0.80
1.60
2.40
3.20
4.00
4.80
5.60
6.40
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
5.60
SUGGESTED PCB LAYOUT
TOP VIEW
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
6.40
0.40 ±0.025 Ø 170x
b
G
DETAIL B
PACKAGE SIDE VIEW
2.00
3.05
2.80
3.60
e
DETAIL A
PACKAGE TOP VIEW
5.35
5.85
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
1.39
0.35
1.04
0.45
0.35
0.39
0.65
NOM
1.54
0.40
1.14
0.50
0.40
15.00
9.00
0.80
12.80
7.20
0.44
0.70
MAX
1.69
0.45
1.24
0.55
0.45
0.49
0.75
0.15
0.10
0.12
0.15
0.08
TOTAL NUMBER OF BALLS: 170
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTXXXXXX
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 170 1112 REV B