CHIP DIODES Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team FAE Team Revised November 24, 2011 Additional Assembly/Test Location for TVS Diode DFN Packages To support increasing demand, secure continuity of supply and provide maximum flexibility to our customers, Bourns is adding an additional Assembly/Test Location in China for the assembly/test of DFN packages for our TVS Diode products. The affected Bourns® part number using the DFN package is CDDFN6-0504P. Qualification: Below are the Qualification Information & Results using the DFN 1.6 x 1.6 - 6L package at the new assembly/test location. Qualification Information: Die Technology Product Name Top Metal Back Metal Assembly Site Pins/Package Mold Compound Die Attach Bond Wire L/F Material Marking Termination Finish All Products TVS Diode Products CDDFN6-0504P Al AlNiAu China DFN 1.6 x 1.6 -6L Sumitomo G770HCD Sumitomo 84-3J Multiple 1 Mil Au Copper Laser Matte Sn (Pb Free) ESD1116 rev. Additional Assembly/Test Location for TVS Diode DFN Packages Revised November 24, 2011 Page 2 of 2 Qualification Results: Test Plan Stress Test Conditions Moisture Induced Stress Sensitivity HTRB 125 °C,1000 h HTSL 150 °C, 1000 h 85 °C / 85 % RH, PCT 1000 h 65 / +150 °C, T Cycle 1000 cs Solderability 8 h Steam Lead Fatigue Lead Pull Lead Adhesion Dimensions Data Sheet Flammability 3 mm W/Bond Pull Strength Die Shear X-Ray - Standard J-STD-020 MIL STD 750 J-STD-22 Method 1048 A103 SS/Acc Level3 76/0 22/0 Lot 1 CDDFN6-0504P SS/fail 66/0 76/0 22/0 J-STD-22 A102 22/0 22/0 J-STD-22 A104 22/0 22/0 JESD22MIL STD 883 MIL STD 883 MIL STD 883 MIL STD 883 UL94-VO B102E 2004 2004 2025 2025 5/0 22/0 22/0 15/0 5/0 5/0 8/0 8/0 8/0 5 MIL STD 883 2011 76/0 76/0 MIL STD 883 MIL STD 883 2019 2012 5/0 5/0 5/0 5/0 Samples subjected are preconditioned according to JESD22-A113 (260 °C). Product Labeling: Product marking is unchanged except for country code information. Labels will show the country of origin code. Identification of the Changed Product: Bourns maintains traceability back to source wafer lots and assembly sites for all products. First Date Code from New Site: 1203 Impact on Form, Fit, Function and Reliability: The package outline dimensions will continue to meet the current Bourns data sheet. Materials specified for packaging are unchanged. Product ratings and electrical characteristics are unaffected by the change. There is no impact on form, fit, function or reliability. Last Date of Manufacture of Existing Product: Bourns has no plans to discontinue assembly & test of products at its existing subcontract sites. Implementation Date: Assembly of product will begin January 2012. Deliveries to customers may occur from May 2012 onwards. If you have any questions, please contact our customer service teams in your region.