October, 2005 Circuit Protection Division Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team N IT CU ECTIO R I C ROT P Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 Mold Compound Change - TO-92 & DO-92 Packages This change notification covers a change to the epoxy mold compound used for encapsulation of TO-92 and DO-92 products assembled by PSI Technologies Inc, Manila, Philippines. The change is: from Plaskon 7060, manufactured by Cookson Electronics to ST-7100-GX, manufactured by Cheil Industries Inc, 332-2 Gochun-Dong, Euiwang-Shi,Kyoungki, Korea. Products Affected by the Change: All products assembled in TO-92 and DO-92 packages are affected. These include catalogue overvoltage protectors, power transistors and thyristors and customer specific products. Existing Part No. TISP® Products TISP4xxxF3LM TISP4xxxF3LMR TISP4xxxF3LMFR TISP4xxxLP TISP4xxxLPR TISP4xxxF3LP TISP4xxxF3LPR TISP4xxxM3LM TISP4xxxM3LMR TISP4xxxM3LMFR TISP4xxxH3LM TISP4xxxH3LMR TISP4xxxH3LMFR Customer Specific R3752-1 R3752-3 Transistors TIPPxx TIPPxxx Thyristors TICP1xx TICP2xx Package Lead Free Product Part Number DO-92 DO-92 DO-92 TO-92 TO-92 TO-92 TO-92 DO-92 DO-92 DO-92 DO-92 DO-92 DO-92 TISP4xxxF3LM-S TISP4xxxF3LMR-S TISP4xxxF3LMFRS TISP4xxxLP-S TISP4xxxLPR-S TISP4xxxF3LP-S TISP4xxxF3LPR-S TISP4xxxM3LM-S TISP4xxxM3LMR-S TISP4xxxM3LMFRS TISP4xxxH3LM-S TISP4xxxH3LMR-S TISP4xxxH3LMFRS TO-92 TO-92 R3752-1-S R3752-3-S TO-92 TO-92 TIPPxx-S TIPPxxx-S TO-92 TO-92 TICP1xx-S TICP2xx-S Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 - Mold Compound Change - TO-92 & DO-92 Packages October, 2005 Page 2 of 4 Reason for the Change: Continuous quality and technology improvement. Product Labeling: No change to the product labeling. Identification of the Changed Product: Bourns maintains traceability back to source wafer lots for all products. Implementation Date: Shipments of finished goods including the new mold compound are expected to commence in February 2006. Commencing Date Code: 608 Impact on Form, Fit, Function and Reliability: There is no impact. ST-7100-Gx is recognized by UL and listed in E115797. The flammability rating is V-O. Qualification Plan: Following page. Last Date of Manufacture of Unchanged Product: February 2006. Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 - Mold Compound Change - TO-92 & DO-92 Packages October, 2005 Page 3 of 4 Qualification Information as Follows: Die Technology Die Name Die size (mil) Top Metal Back Metal Assembly Site Pins/Package Mold Compound Die Attach Wire Bond L/F Material Marking Termination Finish As Results Table (Row 1) As Results Table (Row 2) As Results Table (Row 3) Al AlTiNiAu PSI,Technologies, Manila, Philippines 2/DO-92 & 3/TO-92 ST-7100-GX Ablebond 84-1 LMI/SR4 2 mil Au,Thermosonic Copper Laser Matte Sn or PbSn Qualification Tests: Stress Test/Conditions HTRB, 1000 h, conditions as results table 85 °C/85 % RH, 50 V, 1000 h Temperature Cycle -65/+150 °C, 200 cs Solder Heat Lead Pull X-Ray Wire QSS (1) 009-101 009-102 009-104 009-106 009-110 009-128 Standard MIL STD 883 JEDEC STD 22 MIL STD 883 MIL STD 750 MIL STD 883 MIL STD 883 Notes: 1. QSS Specifications are Bourns Internal Qualification Standards. Method 1015 A101 1010 2031 2004 2012 SS/Accept 129/1 129/1 129/1 22/0 22/0 5/0 Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 - Mold Compound Change - TO-92 & DO-92 Packages October, 2005 Page 4 of 4 Qualification Results: HTRB 85 °C/85 % RH Temperature Cycle Solder Heat Lead Pull X-Ray Wire Stress Test Completion Date: August 2005 Die Technology Product Name Chip Type Chip Size Package Thyristor TICP106M-S LT401LQ 56 x 56 TO-92 Transistor TIPP116-S TA208LQ 65 x 65 TO-92 OVP TISP4350H3LM-S TA230LQ 65 x 65 DO-92 Conditions Result 110 °C, 480 V 45/0 45/0 45/0 22/0 12/0 5/0 150 °C, 64 V 45/0 45/0 45/0 22/0 12/0 5/0 150 °C, 100 V 45/0 45/0 45/0 22/0 12/0 5/0