Circuit Protection Division October, 2005 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team N IT CU ECTIO R I C ROT P Thyristor Surge Protector Product Change Notification PCN Tracking Number 38 Solder Composition Change - SMA & SMB Packages Bourns strives to continuously improve its manufacturing processes and package technology by introducing process and material enhancements when appropriate. Wherever possible materials are standardized to minimize the opportunity for errors. This change notification covers a change to solder paste metal content composition from Sn10Pb88Ag2 to Sn5Pb92.5Ag2.5 for products assembled in SMA and SMB packages. The solder forms the connection between chip metallization and copper lead frame components in SMA/SMB packages. Composition % Solidus Liquidus Sn Pb Ag °C °C Sn10Pb88Ag2 10 88 2 284 292 Sn5Pb92.5Ag2.5 5 92.5 2.5 287 294 Products Affected by the Change: All overvoltage protection products assembled in the SMA and SMB are affected. Products with package code suffixes of AJ, AJR, BJ and BJR will be changed. For lead (Pb) free products, the corresponding codes are AJ-S, AJR-S, BJ-S and BJR-S. Thyristor Surge Protector Product Change Notification PCN Tracking Number 38 - Solder Composition Change - SMA & SMB Packages October, 2005 Page 2 of 4 Surface Mount Packages Existing Part No TISP® Products TISP4xxxL1AJR TISP4xxxL3AJR TISP4xxxM3AJR TISP43xxMMAJR TISP4xxxL1BJR TISP4xxxL3BJR TISP4xxxM3BJR TISP43xxMMBJR TISP4xxxH1BJR TISP4xxxH3BJR TISP4xxxH4BJR TISP4AxxxH3BJR TISP4CxxxxH3BJR TISP5xxxH3BJR TISP1xxxH3BJR TISP3xxxT3BJR Package Lead Free RoHS Compliant SMA SMA SMA SMA SMB SMB SMB SMB SMB SMB SMB SMB SMB SMB SMB3 SMB3 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Lead Free Product Part Number Suffix -S or S TISP4xxxL1AJR-S TISP4xxxL3AJR-S TISP4xxxM3AJR-S TISP43xxMMAJR-S TISP4xxxL1BJR-S TISP4xxxL3BJR-S TISP4xxxM3BJR-S TISP43xxMMBJR-S TISP4xxxH1BJR-S TISP4xxxH3BJR-S TISP4xxxH4BJR-S TISP4AxxxH3BJRS TISP4CxxxH3BJRS TISP5xxxH3BJR-S TISP1xxxH3BJR-S TISP3xxxT3BJR-S Reason for the Change: Continuous quality and technology improvement. Product Labeling: There will be no change to the product labeling. Identification of the Changed Product: Bourns maintains traceability back to source wafer lots for all products. Implementation Date: Shipments of finished goods including the solder composition changes are expected to commence in December 2005. Date Code Product will Include this Processing will be: 50 Impact on Form, Fit, Function and Reliability: None Qualification Plan: Following page. Thyristor Surge Protector Product Change Notification PCN Tracking Number 38 - Solder Composition Change - SMA & SMB Packages October, 2005 Page 3 of 4 Last Date of Manufacture of Unchanged Product: December 2005 Qualification Information as Follows: Die Technology Die Name Die size (mil) Top Metal Back Metal Assembly Site Pins/Package Mold Compound Die Attach Clip Attach L/F Material Marking Termination Finish Thyristor Overvoltage Protector As Results Table (Row 2) As Results Table (Row 3) Al + NiAu Al + NiAu Shanghai Seefull Electronics Co, PRC 2/3 SMB & 2 SMA Sumitomo EME 1100H This Change This Change Copper Laser Matte Sn or PbSn Qualification Tests: Stress Test/Conditions (1) HTRB, 150 °C, 100 V, 1000 h 85 °C/85 % RH, 50 V, 1000 h Temperature Cycle -65/+150 °C, 200cs Bond Strength, 300 g Min (3) QSS (2) 009-101 009-102 009-104 - Standard MIL STD 883 JEDEC STD 22 MIL STD 883 - Method 1015 A101 2031 - Notes: 1. Mechanical/Package Requirements qualified by similarity with existing product. 2. QSS Specifications are Bourns Internal Qualification Standards. 3. Vertical Pull Test. SS/Accept 129/1 129/1 129/1 20/0 Thyristor Surge Protector Product Change Notification PCN Tracking Number 38 - Solder Composition Change - SMA & SMB Packages October, 2005 Page 4 of 4 Qualification Results: Product Name: Chip Type: Chip Size: Package: HTRB 85 °C/85 % RH Temperature Cycle Bond Strength Lot 1 4015L1 LT401LQ 56 x 56 SMB 129/0 129/0 129/0 10/0 Lot 2 4080M3 TA208LQ 65 x 65 SMB 129/0 129/0 129/0 10/0 Lot 3 4300M3 TA230LQ 65 x 65 SMB 129/0 129/0 129/0 10/0 Notes: 1. Mechanical/Package Requirements qualified by similarity with existing product. 2. QSS Specifications are Bourns Internal Qualification Standards. 3. Vertical Pull Test. Stress Test Completion Date: August 2005 Lot 4 4350H3 TW435PQ 94 x 81 SMB 129/0 129/0 129/0 10/0