TC72 Digital Temperature Sensor with SPI Interface Features General Description • • • • • • • TC72 is a digital temperature sensor capable of reading temperatures from -55°C to +125°C. This sensor features a serial interface that allows communication with a host controller or other peripherals. The TC72 interface is compatible with the SPI protocol, and does not require any additional external components. However, it is recommended that a decoupling capacitor of 0.01 µF to 0.1 µF be provided between the VDD and GND pins. Temperature-to-Digital Converter SPI Compatible Interface 10-Bit Resolution (0.25°C/Bit) ±2°C (maximum) Accuracy from -40°C to +85°C ±3°C (maximum) Accuracy from -55°C to +125°C 2.65V to 5.5V Operating Range Low Power Consumption: - 250 µA (typical) Continuous Temperature Conversion Mode - 1 µA (maximum) Shutdown Mode • Power Saving One-Shot Temperature Measurement • Industry Standard 8-Pin MSOP Package • Space Saving 8-Pin DFN (3x3 mm) Package Typical Applications • • • • • • • Personal Computers and Servers Hard Disk Drives and Other PC Peripherals Entertainment Systems Office Equipment Datacom Equipment Mobile Phones General Purpose Temperature Monitoring TC72 can be used either in a Continuous Temperature Conversion mode or a One-Shot Conversion mode. The Continuous Conversion mode measures the temperature approximately every 150 ms and stores the data in the temperature registers. In contrast, the One-Shot mode performs a single temperature measurement and returns to the power saving shutdown mode. TC72 features high temperature accuracy, ease-of-use and is the ideal solution for implementing thermal management in a variety of systems. The device is available in both 8-pin MSOP and 8-pin DFN spacesaving packages. TC72 also features a Shutdown mode for low power operation. Block Diagram VDD Package Types Internal Diode Temperature Sensor TC72 MSOP NC 1 8 VDD CE 2 7 NC SCK 3 6 SDI GND 4 5 SDO 10-Bit Sigma Delta A/D Converter TC72 3x3 DFN* NC 1 SCK 2 CE 3 8 VDD EP 9 GND 4 Temperature Register 7 NC 6 SDO 5 SDI TC72 Manufacturer ID Register Serial Port Interface CE SCK SDO SDI GND Control Register * Includes Exposed Thermal Pad (EP); see Table 3-1. © 2011 Microchip Technology Inc. DS21743B-page 1 TC72 NOTES: DS21743B-page 2 © 2011 Microchip Technology Inc. TC72 1.0 ELECTRICAL CHARACTERISTICS 1.1 Maximum Ratings† † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. VDD........................................................................ 6.0V All inputs and outputs w.r.t. GND ...-0.3V to VDD +0.3V Storage temperature .......................... -65°C to +150°C Ambient temp. with power applied ..... -55°C to +125°C Junction Temperature ........................................ 150°C ESD protection on all pins: Human Body Model (HBM)............................. > 4 kV Man Machine Model (MM)............................. > 400V Latch-Up Current at each pin ........................ ±200 mA Maximum Power Dissipation........................... 250 mW DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C. Parameters Sym Min Typ Max Units Conditions VDD 2.65 — 5.5 V Note 1 IDD-CON — 250 400 µA Continuous Temperature Conversion mode (Shutdown Bit = ‘0’) ISHD — 0.1 1.0 µA Shutdown mode (Shutdown Bit = ‘1’) °C -40°C < TA < +85°C Power Supply Operating Voltage Range Operating Current: Normal Mode, ADC Active Shut-Down Supply Current Temperature Sensor and Analog-to-Digital Converter Temperature Accuracy (Note 1) TACY Resolution ADC Conversion Time -2.0 — +2.0 -3.0 — +3.0 -55°C < TA < +125°C — 10 — Bits tCONV — 150 200 ms VIH 0.7 VDD — — V Note 4 Digital Input / Output High Level Input Voltage Low Level Input Voltage VIL — — 0.2 VDD V High Level Output Voltage VOH 0.7 VDD — — V IOH = 1 mA Low Level Output Voltage VOL — — 0.2 VDD V IOL = 4 mA Input Resistance RIN 1.0 — — MΩ CIN — 15 — pF COUT — 50 — Pin Capacitance Note 1: 2: 3: 4: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6. Measured with a load of CL = 50 pF on the SDO output pin of the TC72. All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times. The rise and fall times are defined as the 10% to 90% transition time. Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit © 2011 Microchip Technology Inc. DS21743B-page 3 TC72 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C. Parameters Sym Min Typ Max Units Conditions Serial Port AC Timing (Note 2, 3) Clock Frequency fCLK DC — 7.5 MHz SCK Low Time tCL 65 — — ns SCK High Time tCH 65 — — ns CE to SCK Setup tCC 400 — — ns SCK to Data Out Valid tCDD — — 55 ns CE to Output Tri-state tCDZ — — 40 ns SCK to Data Hold Time tCDH 35 — — ns Data to SCK Set-up Time tDC 35 — — ns SCK to CE Hold Time tCCH 100 — — ns tR — — 200 ns SCK Rise Time SCK Fall Time CE Inactive Time Note 1: 2: 3: 4: tF — — 200 ns tCWH 400 — — ns The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6. Measured with a load of CL = 50 pF on the SDO output pin of the TC72. All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times. The rise and fall times are defined as the 10% to 90% transition time. Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit TEMPERATURE SPECIFICATION Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C. Parameters Sym Min Typ Max Units Specified Temperature Range TA -55 — +125 °C Operating Temperature Range TA -55 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance 8-L 3x3 DFN θJA — 56.7 — °C/W Thermal Resistance 8-L MSOP θJA — 211 — °C/W Conditions Temperature Ranges Thermal Package Resistances DS21743B-page 4 © 2011 Microchip Technology Inc. TC72 SPI READ DATA TRANSFER (CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 0) tCWH CE tCCH 1/fCLK tCC SCK SDI tDC tCDH A7 MSb tF tR tCH A0 tCL LSb tCDD SDO HIGH Z tCDZ HIGH Z MSb D7 D0 LSb SPI WRITE DATA TRANSFER (CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 1) tCWH CE 1/fCLK tCC tCCH SCK tF SDI A7 = 1 MSb Note: FIGURE 1-1: tCH tR A0 LSb tDC tCDH D7 MSb tCL D0 LSb The timing diagram is drawn with CP = 0. The TC72 also functions with CP = 1; however, the edges of SCK are reversed as defined in Table 4-3 and Figure 4-2. Serial Port Timing Diagrams. © 2011 Microchip Technology Inc. DS21743B-page 5 TC72 NOTES: DS21743B-page 6 © 2011 Microchip Technology Inc. TC72 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 3.5 3 2.5 2 1.5 1 0.5 0 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 0.20 Upper Specification Limit Mean Mean + 3V Mean - 3V Lower Specification Limit Shutdown Current (µA) Temperature Error (°C) Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C. 0.15 TC72-3.3MXX TC72-5.0MXX VDD = 3.3V VDD = 5.0V TC72-5.0MXX VDD = 2.8V 0.10 0.05 0.00 -55 -25 5 35 65 95 125 -55 -25 5 Reference Temperature (°C) FIGURE 2-1: (TC72-X.XMXX). Accuracy vs. Temperature 95 125 FIGURE 2-4: Temperature. Shutdown Current vs. 0.4 Temperature Change (°C) TC72-X.XMXX Supply Current (µA) 65 Temperature (°C) 260 250 TA = +25°C 240 230 220 TA = -55°C 210 TA = +125°C 200 2.5 3.0 3.5 0.3 TC72-2.8MXX 0.2 TA = +85°C 0.1 0.0 -0.1 FIGURE 2-2: Voltage. TA = +25°C -0.3 -0.4 4.0 4.5 5.0 2.6 5.5 2.7 Supply Current vs. Supply 300 250 200 TC72-2.8MXX VDD = 2.8V 150 100 50 0 -55 -25 5 35 65 95 Temperature (°C) FIGURE 2-3: Temperature. Supply Current vs. © 2011 Microchip Technology Inc. 2.9 3.0 FIGURE 2-5: Temperature Accuracy vs. Supply Voltage (TC72-2.8MXX). Temperature Change (°C) TC72-3.3MXX VDD = 3.3V TC72-5.0MXX VDD = 5.0V 2.8 Supply Voltage (V) 400 350 TA = -25°C -0.2 Supply Voltage (V) Supply Current (uA) 35 125 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 TC72-5.0MXX TA = +85°C TA = -25°C TA = +25°C 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 Supply Voltage (V) FIGURE 2-6: Temperature Accuracy vs. Supply Voltage (TC72-5.0MXX). DS21743B-page 7 TC72 TC72-X.XMXX Sample Size = 166 TA = +65°C 50 40 30 20 10 Temperature Error (°C) TC72-X.XMXX Sample Size = 166 TA = -40°C 40 30 20 10 0 1.5 2 -2 -1.5 1.50 1.25 0.75 0.50 0.25 0.00 1.00 1.5 2 Temperature Error (°C) FIGURE 2-9: Histogram of Temperature Accuracy at +25 Degrees C. 25 20 15 10 5 3 2.5 0 2 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -0.25 -0.50 -0.75 0 30 -2 10 -1.00 1 TC72-X.XMXX Sample Size = 166 TA = +125°C 35 -3 20 -1.25 0.5 40 -2.5 30 DS21743B-page 8 0 FIGURE 2-11: Histogram of Temperature Accuracy at +85 Degrees C. Percentage of Occurances (%) TC72-X.XMXX Sample Size = 166 TA = +25°C -1.50 Percentage of Occurances (%) 60 40 -0.5 Temperature Error (°C) FIGURE 2-8: Histogram of Temperature Accuracy at -40 Degrees C. 50 -1 1 1 1.5 0.5 0.5 0 0 -0.5 Temperature Error (°C) -0.5 -1 TC72-X.XMXX Sample Size = 166 TA = +85°C -1 -1.5 50 45 40 35 30 25 20 15 10 5 0 -1.5 -2 -0.25 FIGURE 2-10: Histogram of Temperature Accuracy at +65 Degrees C. Percentage of Occurances (%) Percentage of Occurances (%) 50 -0.50 Temperature Error (°C) FIGURE 2-7: Histogram of Temperature Accuracy at -55 Degrees C. 60 -0.75 -1.00 -1.25 0 -1.50 Percentage of Occurances (%) 60 3 2 2.5 1 0 0.5 -1 -0.5 -2 -1.5 -3 1.5 TC72-X.XMXX Sample Size = 166 TA = -55°C 50 45 40 35 30 25 20 15 10 5 0 -2.5 Percentage of Occurances (%) Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C. Temperature Error (°C) FIGURE 2-12: Histogram of Temperature Accuracy at +125 Degrees C. © 2011 Microchip Technology Inc. TC72 3.0 PIN DESCRIPTION Pin functionalities are described in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE TC72 Symbol 3x3 DFN MSOP 1 1 NC 2 3 SCK 3 2 CE 4 4 GND 3.1 Function No internal connection Serial Clock input Chip Enable input, the device is selected when this input is high Ground 5 6 SDI Serial Data input 6 5 SDO Serial Data output 7 7 NC No internal connection 8 8 VDD Power supply 9 — EP Exposed pad (Ground) No Connection (NC) This pin is not internally connected to the die. 3.2 Serial Clock Input (SCK) The SCK pin is an Input pin. All communication and timing is relative to the signal on this pin. The clock is generated by the host controller on the SPI bus (see Section 4.3 “Serial Bus Interface”). 3.3 Chip Enable Input (CE) 3.7 Power Supply (VDD) VDD is the Power pin. The operating voltage range, as specified in the DC electrical specification table, is applied on this pin. 3.8 Exposed Pad (EP) There is an internal electrical connection between the Exposed Thermal Pad (EP) and the GND pin; they can be connected to the same potential on the Printed Circuit Board (PCB). This provides better thermal conduction from the PCB to the die. The CE is a Chip Enable pin. This is an active high input, therefore the device is enabled when CE is toggled to VDD. Once the device is enabled, all serial communication begins (see Section 4.3 “Serial Bus Interface”). 3.4 Ground (GND) The GND is the system Ground pin. 3.5 Serial Data Input (SDI) The SDI is a Data Input pin, used to transmit data from the host to the device (see Section 4.3 “Serial Bus Interface”). 3.6 Serial Data Output (SDO) The SDO is a Data Output pin, used to transmit data from the device to the host (see Section 4.3 “Serial Bus Interface”). © 2011 Microchip Technology Inc. DS21743B-page 9 TC72 NOTES: DS21743B-page 10 © 2011 Microchip Technology Inc. TC72 4.0 FUNCTIONAL DESCRIPTION The Continuous Conversion mode measures the temperature approximately every 150 ms and stores the data in the temperature registers. TC72 has an internal clock generator that controls the automatic temperature conversion sequence. The automatic temperature sampling operation is repeated indefinitely until TC72 is placed in Shutdown mode by a write operation to the Control register. TC72 will remain in Shutdown mode until the shutdown bit in the Control register is reset. TC72 consists of a band-gap type temperature sensor, a 10-bit Sigma Delta Analog-to-Digital Converter (ADC), an internal conversion oscillator and a double buffer digital output port. The 10-bit ADC is scaled from -128°C to +127°C; therefore, the resolution is 0.25°C per bit. The ambient temperature operating range of the TC72 is specified from -55°C to +125°C. This device features a four-wire serial interface that is fully compatible with the SPI specification and, therefore, allows simple communications with common microcontrollers and processors. TC72 can be used either in a Continuous Temperature Conversion mode or a One-Shot Conversion mode. TC72 temperature measurements are performed in the background and, therefore, reading the temperature via the serial I/O lines does not affect the measurement in progress. MSB LSB 0111 1101 / 0000 0000 In contrast, the One-Shot mode performs a single temperature measurement and returns to the powersaving shut down mode. This mode is especially useful for low power applications. Output Code +25°C +0.25°C MSB LSB 0001 1001 / 0000 0000 MSB LSB 0000 0000 / 0100 0000 MSB LSB 0°C 0000 0000 / 0000 0000 Temp -55°C MSB LSB 1111 1111 / 1100 0000 Temp +125°C MSB LSB 1110 0111 / 0000 0000 -0.125°C -25°C MSB LSB 1100 1001 / 0000 0000 Note: FIGURE 4-1: The ADC converter is scaled from -128°C to +127°C, but the operating range of the TC72 is specified from -55°C to +125°C. Temperature-To-Digital Transfer Function (Non-Linear Scale). © 2011 Microchip Technology Inc. DS21743B-page 11 TC72 4.1 Temperature Data Format 4.3 Temperature data is represented by a 10-bit two’s complement word with a resolution of 0.25°C per bit. The temperature data is stored in the Temperature registers in a two’s complement format. The ADC converter is scaled from -128°C to +127°C, but the operating range of TC72 is specified from -55°C to +125°C. EXAMPLE 4-1: Temperature = +41.5°C MSB Temperature Register = 00101001b = 25 + 23 + 20 = 32 + 8 + 1 = 41 = 10000000b = 2-1 = 0.5 LSB Temperature Register TABLE 4-1: TC72 TEMPERATURE OUTPUT DATA Temperature Binary MSB / LSB Hex +125°C 0111 1101/0000 0000 7D00 +25°C 0001 1001/0000 0000 1900 +0.5°C 0000 0000/1000 0000 0080 +0.25°C 0000 0000/0100 0000 0040 0°C 0000 0000/0000 0000 0000 -0.25°C 1111 1111/1100 0000 FFC0 -25°C 1110 0111/0000 0000 E700 -55°C 1100 1001/0000 0000 C900 TABLE 4-2: TEMPERATURE REGISTER D7 D6 D5 D4 D3 D2 D1 D0 Address/ Register Sign 26 25 24 23 23 21 20 02H Temp. MSB 2-1 2-2 0 0 0 0 0 0 01H Temp. LSB 4.2 Power-Up And Power-Down TC72 is in low-power consumption Shutdown mode at power-up. The Continuous Temperature Conversion mode is selected by performing a Write operation to the Control register, as described in Section 5.0 “Internal Register Structure”. Serial Bus Interface The serial interface consists of the Chip Enable (CE), Serial Clock (SCK), Serial Data Input (SDI) and Serial Data Output (SDO) signals. TC72 operates as a slave and is compatible with the SPI bus specifications. The serial interface is designed to be compatible with the Microchip PIC® family of microcontrollers. The CE input is used to select TC72 when multiple devices are connected to the serial clock and data lines. The CE is active-high, and data is written to or read from the device, when CE is equal to a logic high voltage. The SCK input is disabled when CE is low. The rising edge of the CE line initiates a read or write operation, while the falling edge of CE completes a read or write operation. The SCK input is provided by the external microcontroller and is used to synchronize the data on the SDI and SDO lines. The SDI input writes data into TC72’s Control register, while the SDO outputs the temperature data from the Temperature register and the status of Shutdown bit of the Control register. TC72 has the capability to function with either an active-high or low SCK input. The SCK inactive state is detected when the CE signal goes high, while the polarity of the clock input (CP) determines whether the data is clocked and shifted on either the rising or falling edge of the system clock, as shown in Figure 4-2. Table 4-3 gives the appropriate clock edge used to transfer data into and out of the registers. Each data bit is transferred at each clock pulse, and the data bits are clocked in groups of eight bits, as shown in Figure 4-3. The address byte is transferred first, followed by the data. A7, the MSb of the address, determines whether a read or write operation will occur. If A7 = ‘0’, one or more read cycles will occur; otherwise, if A7 = ‘1’, one or more write cycles will occur. Data can be transferred either in a single byte or a multi-byte packet, as shown in Figure 4-3. In the 3-byte packet, the data sequence consists of the MSb temperature data, LSb temperature data, followed by the Control register data. The multi-byte read feature is initiated by writing the highest address of the desired packet to registers. TC72 will automatically send the register addressed and all of the lower address registers, as long as the Chip Enable pin is held active. A supply voltage lower than 1.6V (typical) is considered a power-down state for TC72. If the supply voltage drops below the 1.6V threshold, the internal registers are reset to the power-up default state. DS21743B-page 12 © 2011 Microchip Technology Inc. TC72 TABLE 4-3: OPERATIONAL MODES Mode CE SCK (Note 1) SDI SDO Disable L Input Disabled Input Disabled High Z Data Bit Latch High Z X Next data bit shift, Note 2 Write (A7 = 1) H CP=1, Data Shifted on Falling Edge, Data Clocked on Rising Edge CP=0, Data Shifted on Rising Edge, Data Clocked on Falling Edge Read (A7 = 0) H CP=1, Data Shifted on Falling Edge, Data Clocked on Rising Edge CP=0, Data Shifted on Rising Edge, Data Clocked on Falling Edge Note 1: 2: 4.4 CP is the Clock Polarity of the microcontroller system clock. If the inactive state of SCK is logic level high, CP is equal to ‘1’; otherwise, if the inactive state of SCK is low, CP is equal to ‘0’. During a Read operation, SDO remains at a high impedance (High Z) level until the eight bits of data begin to be shifted out of the Temperature register. Read Operation The TC72 uses the CE, SCK and SDO lines to output the Temperature and Control register data. Figure 4-3 shows a timing diagram of the read operation. Communication is initiated by the chip enable (CE) going high. The SDO line remains at the voltage level of the LSb bit that is output and goes to the tri-state level when the CE line goes to a logic low level. 4.5 CP = 0 CE SCK SHIFT EDGE Write Operation Data is clocked into the Control register in order to enable TC72’s power saving shutdown mode. The write operation is shown in Figure 4-3 and is accomplished using the CE, SCK and SDI lines. CLOCK EDGE CP = 1 CE SCK SHIFT EDGE FIGURE 4-2: Operation. © 2011 Microchip Technology Inc. CLOCK EDGE Serial Clock Polarity (CP) DS21743B-page 13 TC72 Single Byte Write Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1) CE SCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A7=1 A 7 SDI A 6 A 5 A 4 A 3 A 2 A 1 A 0 D 7 D 6 D 5 D 4 D 3 D 2 D 1 MSb SDO D 0 LSb High Z Single Byte Read Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0) CE SCK 2 1 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A7=0 A 7 SDI A 6 A 5 A 4 A 3 SDO A 2 A 1 A 0 High Z D 7 D 0 MSb LSb High Z SPI Multiple Byte Transfer CE SCK Write Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1) SDI Address Byte = 80hex A7 A0 Control Byte D7 D0 High Z SDO Read Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0) SDI Address Byte = 02hex A0 A7 SDO High Z FIGURE 4-3: DS21743B-page 14 MSB Temp. Byte D7 Control Byte LSB Temp. Byte D0 D7 D0 D7 D0 High Z Serial Interface Timing Diagrams (CP=0). © 2011 Microchip Technology Inc. TC72 5.0 INTERNAL REGISTER STRUCTURE TC72 registers are listed below. TABLE 5-1: REGISTERS FOR TC72 Read Address Write Address Bit 7 Bit 6 Bit 5 Bit 4 Control 00hex 80hex 0 0 0 One-Shot (OS) 0 1 LSB Temperature 01hex N/A T1 T0 0 0 0 0 MSB Temperature 02hex N/A T9 T8 T7 T6 Manufacturer ID 03hex N/A 0 1 0 1 Register 5.1 Control Register The Control register is both a read and a write register that is used to select either the Shutdown, Continuous or One-Shot Conversion operating mode. The Temperature Conversion mode selection logic is shown in Table 5-2. The Shutdown (SHDN) bit is stored in bit 0 of the Control register. If SHDN is equal to ‘1’, TC72 will go into power-saving Shutdown mode. If SHDN is equal to ‘0’, TC72 will perform a temperature conversion approximately every 150 ms. At power-up, the SHDN bit is set to ‘1’. Thus, TC72 is in Shutdown operating mode at startup. Continuous Temperature Conversion mode is selected by writing a ‘0’ to the SHDN bit of the Control register. Shutdown mode can be used to minimize the power consumption of TC72 when active temperature monitoring is not required. The Shutdown mode disables the temperature conversion circuitry; however, the serial I/O communication port remains active. A temperature conversion will be initialized by a Write operation to the Control register to select either the Continuous Temperature Conversion or the OneShot operating mode. The temperature data will be available in the MSB and LSB Temperature registers approximately 150 ms after the Control register Write operation. Bit Bit Bit 3 2 1 Bit 0 Value on POR/BOR 0 Shutdown (SHDN) 05hex 0 0 00hex T5 T4 T3 T2 00hex 0 0 54hex 1 0 One-Shot mode is selected by writing a ‘1’ into bit 4 of the Control register. The One-Shot mode performs a single temperature measurement and returns to the power-saving Shutdown mode. After completion of the temperature conversion, the One-Shot bit (OS) is reset to ‘0’ (i.e. “OFF”). The user must set the One-Shot bit to ‘1’ to initiate another temperature conversion. Bits 1, 3, 5, 6 and 7 of the Control register are not used by TC72. Bit 2 is set to a logic ‘1’. Any write operation to these bit locations will have no affect on the operation of TC72. 5.2 Temperature Register The Temperature register is a read-only register and contains a 10-bit two’s complement representation of the temperature measurement. Bit 0 through Bit 5 of the LSB Temperature register are always set to a logic ‘0’. At Power-On Reset (POR) or a Brown-Out Reset (BOR) low voltage occurrence, the temperature register is reset to all zeroes, which corresponds to a temperature value of 0°C. A VDD power supply less than 1.6V is considered a reset event and will reset the Temperature register to the power-up state. 5.3 Manufacturer ID Register The Manufacturer Identification (ID) register is a readonly register used to identify the temperature sensor as a Microchip component. TABLE 5-2: CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION Operational Mode One-Shot (OS) Bit 4 Shutdown (SHDN) Bit 0 Continuous Temperature Conversion 0 0 Shutdown 0 1 Continuous Temperature Conversion (One-Shot Command is ignored if SHDN = ‘0’) 1 0 One-Shot 1 1 © 2011 Microchip Technology Inc. DS21743B-page 15 TC72 NOTES: DS21743B-page 16 © 2011 Microchip Technology Inc. TC72 6.0 APPLICATIONS INFORMATION The TC72 does not require any additional components in order to measure temperature; however, it is recommended that a decoupling capacitor of 0.1mF to 1mF be provided between the VDD and GND pins. Although the current consumption of the TC72 is modest (250 mA, typical), the TC72 contains an on chip data acquisition with internal digital switching circuitry. Thus, it is considered good design practice to use an external decoupling capacitor with the sensor. A high frequency ceramic capacitor should be used and be located as close as possible to the IC power pins in order to provide effective noise protection to the TC72. The TC72 measures temperature by monitoring the voltage of a diode located on the IC die. The IC pins of the TC72 provide a low impedance thermal path between the die and the PCB, allowing the TC72 to effectively monitor the temperature of the PCB board. The thermal path between the ambient air is not as efficient because the plastic IC housing package functions as a thermal insulator. Thus, the ambient air temperature (assuming that a large temperature gradient exists between the air and PCB) has only a small effect on the temperature measured by the TC72. VDD 0.1µF VDD TC72 CE PICmicro® MCU I/O SCK SCK SDO SDI SDI SDO GND FIGURE 6-1: Typical Application. Note that the exposed metal center pad on the bottom of the DFN package is connected to the silicon substrate. The center pad should be connected to either the PCB ground plane or treated as a “No Connect” pin. The mechanical dimensions of the center pad are given in Section 7.0 “Packaging Information” of this data sheet. A potential for self-heating errors can exist if the TC72 SPI communication lines are heavily loaded. Typically, the self-heating error is negligible because of the relatively small current consumption of the TC72. A temperature accuracy error of approximately +0.5°C will result from self-heating if the SPI communication pins sink/source the maximum current specified for the TC72. Thus, to maximize temperature accuracy, the output loading of the SPI signals should be minimized. © 2011 Microchip Technology Inc. DS21743B-page 17 TC72 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 8-Lead MSOP XXXXXX YWWNNN 8-Lead DFN XXXXXXXX MYWW NNN Legend: XX...X Y YY WW NNN e3 * Note: DS21743B-page 18 Example: TC722M 109256 Example: 7228 M109 256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2011 Microchip Technology Inc. TC72 )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 NOTE 1 1 2 e b A2 A c φ L L1 A1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ ± %6& ± 0ROGHG3DFNDJH7KLFNQHVV $ 6WDQGRII $ ± 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( %6& 2YHUDOO/HQJWK ' %6& )RRW/HQJWK / )RRWSULQW / %6& 5() )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% © 2011 Microchip Technology Inc. DS21743B-page 19 TC72 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21743B-page 20 © 2011 Microchip Technology Inc. TC72 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2011 Microchip Technology Inc. DS21743B-page 21 TC72 ! "!#$%$%&'*,/! )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS21743B-page 22 © 2011 Microchip Technology Inc. TC72 APPENDIX A: REVISION HISTORY Revision B (July 2011) The following is the list of modifications: 1. 2. 3. 4. Updated DFN pin drawing. Added new chapter Section 3.0 “PIN Description”. Moved Typical Application figure in Section 6.0 “Applications information” (see Figure 6-1). Updated Section 7.0 “Packaging Information” Revision A (October 2002) • Original data sheet for the TC72 device. © 2011 Microchip Technology Inc. DS21743B-page 23 TC72 NOTES: DS21743B-page 24 © 2011 Microchip Technology Inc. TC72 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XX X Voltage Temperature Range Range /XX Package Device: TC72: Digital Temperature Sensor w/SPI Interface Voltage Range: 2.8 3.3 5.0 = Accuracy Optimized for 2.8V = Accuracy Optimized for 3.3V = Accuracy Optimized for 5.0V Temperature Range: M =-55°C to +125°C Package: MF = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead MFTR = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead UATR = Plastic Micro Small Outline (MSOP), 8-lead (Tape and Reel) © 2011 Microchip Technology Inc. Examples: a) TC72-2.8MUA: b) TC72-2.8MUATR: c) TC72-2.8MMF: d) TC72-3.3MUA: e) TC72-3.3MMF: f) TC72-5.0MUA: g) TC72-5.0MMF: h) TC72-5.0MMFTR: Digital Temperature Sensor, 2.8V, 8LD MSOP package. Digital Temperature Sensor, 2.8V, 8LD MSOP (tape and reel) package. Digital Temperature Sensor, 2.8V, 8LD DFN package. Digital Temperature Sensor, 3.3V, 8LD MSOP package. Digital Temperature Sensor, 3.3V, 8LD DFN package. Digital Temperature Sensor, 5.0V, 8LD MSOP package. Digital Temperature Sensor, 5.0V, 8LD DFN package. Digital Temperature Sensor, 5.0V, 8LD DFN (tape and reel) package. DS21743B-page 25 TC72 NOTES: DS21743B-page 26 © 2011 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-61341-429-3 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2011 Microchip Technology Inc. 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