HA17324/A Series Quad Operational Amplifier ADE-204-031 (Z) 1st Edition Apr. 2000 Description HA17324 series and HA17324A series are quad operational amplifier that provide high gain and internal phase compensation, with single power supply. They can be widely used to control equipments. Features • Wide range of supply voltage, and single power supply used • Internal phase compensation • Wide range of common mode voltage, and possible to operate with an input about 0V Features only for “A” series • Low electro-magnetic interference level Measurement Condition 5.0 Output Offset Voltage vs. Input Interference Rs Rs − + Rf 0.01 µ Vin −10 dBm RF signal source (for quasi-RF noise) Vout V _ (= 100∗Vio) Output offset voltage (arb. unit) Rf Vcc = +7.5 V Vee = −7.5 V 4.0 HA17324 series 3.0 2.0 1.0 HA17324A series 0 −1.0 100E+3 1E+6 10E+6 100E+6 1E+9 Input RF frequency (Hz) 10E+9 Notice: The example of an applied circuit or combination with other equipment shown herein indicates characteristics and performance of semiconductor -applied products. The company shall assume no responsibility for any problem involving a patent caused when applying the descriptions in the example. HA17324/A Series Ordering Information HA17324 Series Type No. Application Package HA17324P Industrial use DP-14 HA17324FP HA17324 FP-14DA Commercial use HA17324F DP-14 FP-14DA HA17324A Series Type No. Application Package HA17324AP Industrial use DP-14 HA17324ARP FP-14DN HA17324AFP FP-14DA 2 HA17324/A Series Pin Arrangement Vout1 1 Vin(−)1 2 Vin(+)1 3 VCC 4 Vin(+)2 5 Vin(−)2 6 Vout2 7 14 Vout4 4 + − 1 − + 13 Vin(−)4 12 Vin(+)4 11 VEE + − 3 − + 2 10 Vin(+)3 9 Vin(−)3 8 Vout3 (Top view) Circuit Schematic (1/4) Q5 Vin(−) Q1 Q2 Q3 Q4 Q6 Q7 C R1 Vin(+) Vout Q11 Q10 Q8 Q13 Q12 Q9 3 HA17324/A Series Absolute Maximum Ratings (Ta = 25°C) Ratings Item Symbol HA17324/P/AP HA17324F/FP/ARP/AFP Unit Supply voltage VCC 32 32 V Sink current Isink 50 50 1 mA 2 Power dissipation PT 625 * 625 * mW Common mode input voltage VCM –0.3 to VCC –0.3 to VCC V Differential input voltage Vin (diff) ±VCC ±VCC V Operating temperature Topr –20 to +75 –20 to +75 °C Storage temperature Tstg –55 to +125 –55 to +125 °C Notes: 1. This is the allowable values up to Ta = 50°C. Derate by 8.3 mW/°C. 2. Tjmax = θj-a · PCmax + Ta (θj-a; Thermal resistor between junction and ambient at set board use). The wiring density and the material of the set board must be chosen for thermal conductance of efficacy board. And P C max cannot be over the value of P T. 40 mm 240 a b Thermal resistor θj-a (°C) 220 200 SO 180 P1 4− 160 140 120 100 1.5 t epoxy wi th co mp SO ou P1 4− no nd a. Class epoxy board of 10% wiring density b. Class epoxy board of 30% wiring density co mp ou nd 80 0.5 1 2 5 10 Thermal conductance of efficacy board (W/m °C) 4 20 HA17324/A Series Electrical Characteristics (VCC = +15 V, Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Input offset voltage VIO — 2 7 mV VCM = 7.5 V, RS = 50 Ω, Rf = 50 kΩ Input offset current I IO — 5 50 nA VCM = 7.5 V, IIO = | II (–) – I I (+) | Input bias current I IB — 30 500 nA VCM = 7.5 V Power source rejection ratio PSRR — 93 — dB f = 100 Hz, RS = 1 kΩ, Rj = 100 kΩ Voltage gain AVD 75 90 — dB RS = 1 kΩ, Rf = 100 kΩ, RL = ∞ Common mode rejection ratio CMR — 80 — dB RS = 50 Ω, Rf = 5 kΩ Common mode input voltage range VCM –0.3 — 13.5 V RS = 1 kΩ, Rf = 100 kΩ, f = 100 Hz Maximum output voltage Vop-p — 13.6 — V f = 100 Hz, RS = 1 kΩ, Rf = 100 kΩ, RL = 20 kΩ Output source current Iosource 20 40 — mA VIN+ = 1 V, VIN– = 0 V, VOH = 10 V Output sink current Iosink 10 20 — mA VIN = 0 V, VIN = 1 V, VOL = 2.5 V Supply current I CC — 0.8 2 mA VIN = GND, RL = ∞ Slew rate SR — 0.19 — V/µs f = 1.5 kHz, VCM = 7.5 V, RL = ∞ Channel separation CS — 120 — dB f = 1 kHz Output sink current Iosink 15 50 — µA VIN+ = 0 V, VIN– = 1 V, VOL = 200 mV Iosink 3 9 — mA VIN+ = 0 V, VIN– = 1 V, VOL = 1 V VOH 13.2 13.6 — V I OH = –1 mA VOH 12.0 13.3 — V I OH = –10 mA VOL — 0.8 1.0 V I OL = 1 mA VOL — 1.1 1.8 V I OL = 10 mA Output voltage Output voltage 5 HA17324/A Series Output Source Current vs. Ambient Temperature 80 VCC = 15 V 70 VOH = 10 V 60 50 40 30 20 10 0 −20 0 20 40 60 Ambeint temperature Ta (°C) Input Bias Current vs. Ambient Temperature 80 Input bias current IIB (nA) Output source current Iosource (mA) Characteristic Curves VCC = 15 V VCM = 7.5 V 70 60 50 40 30 20 10 0 −20 80 2 1 8 16 24 32 Supply voltage VCC (V) 80 Input bias current IIB (nA) Supply current ICC (mA) Ta = 25°C 3 0 40 20 0 40 Ta = 25°C RL = ∞ 120 80 40 40 Maximum output voltage VOP-P (V) Voltage gain AVD (dB) 6 8 16 24 32 Supply voltage VCC (V) 40 Maxlmum Output Voltage vs. Frequency 160 8 16 24 32 Supply voltage VCC (V) Ta = 25°C 60 Voltage Gain vs. Supply Voltage 0 80 Input Bias Current vs. Supply Voltage Supply Current vs. Supply Voltage 4 0 20 40 60 Ambeint temperature Ta (°C) 20 VCC = 15 V Ta = 25°C RL = 20 kΩ 16 12 8 4 0 1k 3k 10 k 30 k 100 k 300 k Frequency f (Hz) 1M HA17324/A Series Voltage Gain vs. Frequency 120 VCC = 15V Ta = 25°C RL = ∞ 80 60 40 20 0 1 3 10 30 100 300 1k 3k Frequency f (Hz) 10 k 30 k 100 k 300 k 1M Common Mode Rejection Ratio vs. Frequency 120 Common mode rejection ratio CMR (dB) Voltage gain AVD (dB) 100 VCC = 15V Ta = 25°C RS = 50 Ω 100 80 60 40 20 0 100 300 1k 3 k 10 k 30 k 100 k 300 k Frequency f (Hz) 1M 7 HA17324/A Series Solder Mounting Method 1. Small and light surface-mount packages require spicial attentions on solder mounting. On solder mounting, pre-heating before soldering is needed. The following figure show an example of infrared rays refow. Temperature 2. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress. Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic substrates. 235°C Max 10 s Max 140 to 160°C ≅ 60 s 1 to 4°C/s 1 to 5°C/s Time (s) Figure 1 An Example of Infrared Rays Reflow Conditions 8 HA17324/A Series Package Dimensions Unit: mm 19.20 20.32 Max 8 6.30 7.40 Max 14 1.30 7 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 2.39 Max 7.62 2.54 Min 5.06 Max 1 + 0.10 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Mass (reference value) DP-14 Conforms Conforms 0.97 g Unit: mm 10.06 10.5 Max 8 5.5 14 1 0.10 ± 0.10 1.42 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 7 + 0.20 7.80 – 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Mass (reference value) FP-14DA — Conforms 0.23 g 9 HA17324/A Series Unit: mm 8.65 9.05 Max 8 1 7 *0.20 ± 0.05 0.635 Max 1.75 Max 3.95 14 + 0.10 6.10 – 0.30 1.08 *0.40 ± 0.06 0.11 0.14 +– 0.04 0° – 8° 1.27 0.67 0.60 +– 0.20 0.15 0.25 M *Pd plating 10 Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DN Conforms Conforms 0.13 g HA17324/A Series Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Straβe 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 2000. All rights reserved. Printed in Japan. 11