MATERIAL DECLARATION SHEET SMB Package Type (DO-214AA) Product Line Compliance Date November 31, 2004 RoHS Compliant Yes (-S suffix) MSL 1 Bourns TISP® products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP4C250H3BJR-S. No. 1 2 3 4 5 Construction Element (subpart) Encapsulation Leadframe Chip Die Attach Terminal Finish Homogeneous Material Epoxy resin Copper alloy Silicon Solder Matte Sn Total weight Headquarters Riverside CA Homogeneous Material\ Substances if applicable Materials Mass % Material Mass % of total unit wt. Amorph. Silica (SiO2) 7631-86-9 43.00 23.250 Quartz (SiO2) 14808-60-7 33.00 17.843 Epoxy Resin Proprietary 15.00 8.111 Phenol Formaldehyde 9003-35-4 8.00 4.326 Boron Zinc Hydroxide 138265-88-0 0.70 0.378 Material weight [g] 0.058014 0.043397 0.003085 0.000654 0.002142 CASRN Carbon Black 1333-86-4 0.30 0.162 Copper 7440-50-8 97.57 39.465 Iron 7439-89-6 2.30 0.930 Zinc 7440-66-6 0.10 0.040 Phosphorous 7723-14-0 0.03 0.012 Silicon 7440-21-3 92.96 2.673 Aluminium 7429-90-5 4.14 0.119 Nickel 7440-02-0 2.77 0.080 Gold 7440-57-5 0.13 0.004 Lead 7439-92-1 92.50 0.564 Tin 7440-31-5 5.00 0.030 Silver 7440-22-4 2.50 0.016 Tin 7440-31-5 100.00 1.997 Subpart mass of total wt. (%) 54.071 40.448 2.875 0.610 1.997 0.107292 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Rev Aug 2014 page 1 of 1