MATERIAL DECLARATION SHEET SMA Package Type (DO-214AC) Product Line Compliance Date November 31, 2004 RoHS Compliant Yes (-S suffix) MSL 1 Bourns TISP® products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP4C250H3BJR-S. No. 1 2 3 4 5 Construction Element (subpart) Encapsulation Leadframe Chip Die Attach Terminal Finish Homogeneous Material Epoxy resin Copper alloy Silicon Solder Matte Sn Total weight Headquarters Riverside CA Homogeneous Material\ Substances if applicable Materials Mass % Material Mass % of total unit wt. Amorph. Silica (SiO2) 7631-86-9 43.00 18.308 Quartz (SiO2) 14808-60-7 33.00 14.050 Epoxy Resin Proprietary 15.00 6.387 Phenol Formaldehyde 9003-35-4 8.00 3.406 Boron Zinc Hydroxide 68541-56-0 0.70 0.298 Material weight [g] 0.042577 0.030754 0.001390 0.000222 0.000803 CASRN Carbon Black 1333-86-4 0.30 0.128 Copper Iron 7440-50-8 7439-89-6 97.57 2.30 30.007 0.707 Zinc 7440-66-6 0.10 0.031 Phosphorous 7723-14-0 0.03 0.009 Silicon 7440-21-3 90.41 1.257 Aluminium Nickel 7429-90-5 7440-02-0 3.18 6.12 0.044 0.085 Gold 7440-57-5 0.28 0.004 Lead 7439-92-1 92.50 0.205 Tin 7440-31-5 5.00 0.011 Silver 7440-22-4 2.50 0.006 Tin 7440-31-5 100.00 0.803 Subpart mass of total wt. (%) 56.211 40.601 1.835 0.293 1.060 0.075746 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Rev July 2012 page 1 of 1