MATERIAL DECLARATION SHEET Package Type SOD323 Product Line Diode Array Compliance Date January 1st, 2006 RoHS Compliant No. 1 Construction Element (subpart) Encapsulation (EIAJ SC76) Yes Homogeneous Material Epoxy resin MSL 1 Material weight [g] 0.0027 Homogeneous Material\ Substances CASRN if applicable Materials Mass % Fused Silica (SiO2) Epoxy resin Epoxy CN Phenol resin 60676-86-0 na 29690-82-2 na 87.70 5.00 2.00 5.00 Copper 7440-50-8 94.56 Carbon Black 2 3 Leadframe Chip Copper alloy Silicon 0.0021 0.0004 Iron Zinc Die Attach Silver epoxy 0.000080 5 Bond wires Gold 6 Terminal Finish Matte Tin Total Weight 7439-89-6 7440-66-6 0.30 2.23 0.01 Phosphorous 7723-14-0 0.03 Silver (Plating) 7440-22-4 3.17 43.92 2.50 1.00 2.50 0.87 0.00 0.01 6.70 Nickel 7440-02-0 3.08 0.22 Silver 7440-57-5 7440-22-4 0.13 75.00 38.87 1.23 93.73 3.05 50.08 0.15 7440-21-3 7429-90-5 Subpart mass of total wt. (%) 36.75 Silicon Aluminium Gold 4 1333-86-4 Material Mass % of total unit wt. 0.22 7.15 0.01 1.12 1.50 Epoxy 9003-36-5 25.00 0.37 0.00004 Gold 7440-57-5 100.00 0.83 0.83 0.00008 Matte Tin 7440-31-5 100.00 1.41 1.57 0.005400 Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Rev Sept 2011 page 1 of 1