Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack (CQFP) 0.012 M C A S - B S R68.A D S 68 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S D INCHES D S SYMBOL D1 A PIN NO. 1 L e A A -AE1 e2 E -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS MAX 0.075 MIN 0.135 1.91 3.43 - 0.016 0.023 0.41 0.58 2 b1 0.016 0.020 0.41 0.51 2 c 0.008 0.015 0.20 0.38 2 c1 0.008 0.012 0.20 0.31 2 D 1.640 1.870 41.66 47.50 - E 1.640 1.870 41.66 47.50 - D1 0.940 0.960 23.88 24.38 - E1 0.940 0.960 23.88 24.38 4 e 0.050 BSC - 0.012 - 0.31 - - e2 0.012 - 0.31 - - L 0.350 0.450 8.89 Q 0.070 0.120 1.78 M - 0.0015 - 68 11.43 3.05 0.04 68 6 2 3 Rev. 0 11/19/96 c A Q -C(b) b1 SECTION A-A 1.27 BSC e1 N c1 NOTES b -D- M MAX (c) NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. N is the maximum number of terminal positions. 4. Measure dimension e1 at all four corners. 5. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 6. Dimension Q shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum-when solder dip lead finish is applied. 7. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 8. Controlling dimension: Inch. 58