Package Outline Drawing (POD)

Hermetic Packages for Integrated Circuits
Package Outline Drawing
R64.A
64 CERAMIC QUAD FLATPACK PACKAGE (CQFP)
Rev 5, 10/13
1.118 (28.40)
1.080 (27.43)
0.567 (14.40)
0.547 (13.90)
0.290 (7.37)
0.255 (6.48)
64
0.025 (0.635) BSC
49
1
PIN 1
INDEX AREA
48
0.567 (14.40)
0.547 (13.90)
1.118 (28.40)
1.080 (27.43)
0.010 (0.25)
0.006 (0.15)
33
16
17
32
SEE DETAIL "A"
TOP VIEW
0.105 (2.67)
0.075 (1.91)
0.0075 (0.188)
0.005 (0.125)
SIDE VIEW
0.380 (9.655)
0.370 (9.395)
PIN 1
INDEX AREA
1
64
NOTE:
1. All dimensions are in inches (millimeters).
BOTTOM VIEW
1
0.008 (0.20)
REF
DETAIL “A”
0.100 (2.537)
0.085 (2.157)