Package Outline Drawing (POD)

Hermetic Packages for Integrated Circuits
Package Outline Drawing
R48.B
48 CERAMIC QUAD FLATPACK PACKAGE (CQFP) WITH BOTTOM HEATSINK
Rev 0, 10/12
1.118 (28.40)
1.080 (27.43)
0.572 (14.53)
0.555 (14.10)
#1 #48
0.287 (7.29)
0.253 (6.43)
0.040 (1.016) BSC
PIN 1
INDEX AREA
1.118 (28.40)
1.080 (27.43)
0.572 (14.53)
0.555 (14.10)
0.012 (0.30)
0.008 (0.20)
TOP VIEW
0.131 (3.33)
0.105 (2.67)
0.042 (1.067) REF
0.026 (0.66) MIN. 2
0.013 (0.33)
0.009 (0.23)
HEATSINK
SIDE VIEW
0.359 (9.12)
0.349 (8.87)
HEATSINK
0.359 (9.12)
0.349 (8.87)
PIN 1
INDEX AREA
NOTES:
1. All dimensions are in inches (millimeters)
2. Dimension shall be measured at point of exit
(beyond the meniscus) of the lead from the body.
1
#1 #48
BOTTOM VIEW