Hermetic Packages for Integrated Circuits Package Outline Drawing R64.C 64 CERAMIC QUAD FLATPACK PACKAGE (CQFP) WITH BOTTOM HEATSINK Rev 1, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 1 49 PIN 1 INDEX AREA 48 0.567 (14.40) 0.547 (13.90) 1.118 (28.40) 1.080 (27.43) 0.010 (0.25) 0.006 (0.15) 33 16 17 32 SEE DETAIL "A" TOP VIEW 0.0075 (0.188) 0.005 (0.125) 0.135 (3.43) 0.111 (2.82) SIDE VIEW HEATSINK 0.405 (10.29) 0.395 (10.03) 0.380 (9.655) 0.370 (9.395) 0.100 (2.537) 0.085 (2.157) 0.008 (0.20) REF 0.048 (1.22) REF 0.026 (0.66) MIN. 2 HEATSINK DETAIL "A" PIN 1 INDEX AREA 0.405 (10.29) 0.395 (10.03) 1 64 NOTES: 1. All dimensions are in inches (millimeters) BOTTOM VIEW 1 2. Dimension shall be measured at point of exit (beyond the meniscus) of the lead from the body.