Plastic Packages for Integrated Circuits Package Outline Drawing V352.27x27 352 PLASTIC BALL GRID ARRAY PACKAGE Rev 0, 3/11 0.20 (4X) 27.00 0.25 C 24.00±0.03 A1 BALL PAD INDICATOR 0.35 C A 0.20 C B C 30° TYP +0.10 3. 0.60 - 0.10 0.25 M C A B 0.10 M C 27.00 24.00±0.30 4. SEATING PLANE 4X 45° CHAMFER TOP VIEW (1.17) 2.23 ±0.13 0.50±0.10 (0.56) 26 24 22 20 18 16 14 12 10 8 6 4 2 25 23 21 19 17 15 13 11 9 7 5 3 1 SIDE VIEW A B C D E F G H J K L M N 25.00 P R T U V W Y AA AB AC AD AE AF 1.00 NOTES: 1. All dimensions and tolerances conform to ASME Y14.5-1994. 2. Dimensions are in millimeters. 3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C. 4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls. 5. This drawing confirms to the JEDEC registered outline MS-034 variation AAL-1. 6. Dimensions in ( ) are for reference only 1.00 3X R (0.50) 25.00 BOTTOM VIEW 1.00 1.00 NON SOLDERMASK DEFINED PADS. SOLDERMASK OPENING = (0.55) mm TYP x352 PAD DIAMATER = (0.42) mm TYP X352 TYPICAL RECOMMENDED LAND PATTERN 1