Plastic Packages for Integrated Circuits Package Outline Drawing L10.3x3 10 LEAD DUAL FLAT PACKAGE (DFN) Rev 11, 3/15 3.00 5 PIN #1 INDEX AREA A B 1 5 PIN 1 INDEX AREA (4X) 3.00 2.00 8x 0.50 2 10 x 0.23 0.10 1.60 TOP VIEW 10x 0.35 BOTTOM VIEW (4X) 0.10 M C A B 0.415 0.200 0.23 0.35 (10 x 0.55) SEE DETAIL "X" (10x 0.23) 1.00 MAX 0.10 C 0.20 2.00 (8x 0.50) BASE PLANE C SEATING PLANE 0.08 C SIDE VIEW 0.415 C 1.60 0.20 REF 4 0.05 2.85 TYP DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.