Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L10.3x2
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE WITH E-PAD (TDFN)
Rev 1, 4/15
1.40
2.00
6
A
PIN #1 INDEX AREA
B
1
0.50
2.39
3.00
6
PIN 1
INDEX AREA
0.25
(4X)
0.15
(10x0.30)
0.84
TOP VIEW
BOTTOM VIEW
(10x0.20)
Package Outline
(10x0.30)
(10X0.25)
0.75
SEE DETAIL "X"
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
3.00
2.39
0.05
(8x 0.50)
0.20 REF
5
C
0.84
2.00
0.05
DETAIL “X”
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
2.
3.
4.
Dimensions are in mm. Dimensions in ( ) for reference only.
Dimensioning and tolerancing conform to AMSEY14.5m-1994.
Unless otherwise specified, tolerance : Decimal ±0.05
Dimension b applies to the metalized terminal and is measured between
0.18mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature and may be located
on any of the 4 sides (or ends).
6. The configuration of the pin #1 identifier is optional, but must be located
within the zone indicated. The pin #1 identifier may be either a mold or
mark feature.
1