Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L7.2.0x3.4
7 LEAD OPTICAL CO-PACKAGE
Rev 0, 5/14
2.0 ±0.050
0.25
INCLUDED L/F THICKNESS 0.2mm
1 ±0.100
0.373
R 0.25
0.45
0.75
0.45
7
1.2
3.4 ±0.050
1.365
83°
DAP
0.808
6
0.3
1
2
5
1.55
7x 0.2
0.45
3
4
0.35
10°
0.323
0.35
0.884
0.875
1
TOP VIEW
SIDE VIEW/ DETAIL
0.558
SIDE VIEW
R 0.375
BOTTOM VIEW
PACKAGE OUTLINE
0.75
1.2
0.45
0.2
0.35
0.25
0.808
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Pin #1 identifier is a feature on the bottom surface.
5.
No routing allowed underneath the die attach paddle (DAP) area.