Plastic Packages for Integrated Circuits Package Outline Drawing L10.3x2.6 10 LEAD OPTICAL DUAL FLAT NO-LEAD PACKAGE (ODFN) Rev 1, 4/15 6 PIN 1 INDEX AREA A 3.00 0.70 3.00 B 0.50 0.30 2.25 2.60 2.60 b 4 (4X) 0.25 0.10 0.10 TOP VIEW 0.10 M C A B 0.10 0.85 BOTTOM VIEW 1.15 PACKAGE OUTLINE 1.20 SEE DETAIL "X" 0.10 C C BASE PLANE SEATING PLANE 0.08 C 0.30 SIDE VIEW 0.25 (10X) 0.50 (6X) 1.05 1.30 C 3.40 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.015mm and 0.30mm from the terminal tip. 1 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimension tolerance is ±0.05.