Package Outline Drawing

Plastic Packages for Integrated Circuits
Package Outline Drawing
L10.3x2.6
10 LEAD OPTICAL DUAL FLAT NO-LEAD PACKAGE (ODFN)
Rev 1, 4/15
6
PIN 1
INDEX AREA
A
3.00
0.70
3.00
B
0.50
0.30
2.25
2.60
2.60
b 4
(4X)
0.25
0.10
0.10
TOP VIEW
0.10 M C A B
0.10
0.85
BOTTOM VIEW
1.15
PACKAGE
OUTLINE
1.20
SEE DETAIL "X"
0.10 C
C
BASE PLANE
SEATING PLANE
0.08 C
0.30
SIDE VIEW
0.25 (10X)
0.50 (6X)
1.05
1.30
C
3.40
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.015mm and 0.30mm from the terminal tip.
1
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7.
Dimension tolerance is ±0.05.