Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Low Plastic Quad Flatpack Packages (LQFP)
Q128.14x14
4X
128 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE .4 MM
PITCH
0.2 Y T-U Z
D
PIN 1
MILLIMETERS
97
Z
128
1
SYMBOL
96
U
T
E1
E
MIN
-
1.60
-
0.05
0.15
-
A2
1.35
1.40
1.45
-
b
0.13
0.16
0.23
4
b1
0.13
-
0.19
-
c
0.09
-
0.20
-
c1
0.09
-
0.16
-
D
16 BSC
-
D1
14 BSC
3
E
16 BSC
-
64
D1
0.2 H T-U Z
4X
14 BSC
0.45
L1
R1
33
DETAIL F
H
NOTES
A
L
65
MAX
A1
E1
32
NOM
0.60
3
0.75
-
1.00 REF
-
0.08
-
-
-
R2
0.08
-
0.20
-
S
0.20
-
-
-
0
0°
3.5°
7°
-
01
0°
-
-
-
02
11°
12°
13°
-
03
11°
12°
13°
-
N
128
-
e
0.40 BSC
Rev. 1 7/11
128X b
Y
124X
SEATING PLANE
0.07 M Y T-U
b1
c1
c
0.05
PLATING
02
b
01
A
R1
A2
R2
A1
0.080 Y
e
03
S
DETAIL F
1
0
L
(L1)
0.25 GAUGE
PLANE
NOTES:
1. Dimensions are in millimeters. Dimensions in ( ) for
Reference Only.
2. Dimensions and tolerances per AMSEY14.5M-1994.
3. Dimensions D1 and E1 are excluding mold protrusion.
Allowable protrusion is 0.25 per side. Dimensions D1
and E1 are exclusive of mold mismatch and determined by datum plane H.
4. Dimension b does not include dambar protrusion.
Allowable dambar protrusion shall not cause the lead
width to exceed the maximum b dimension by more
than 0.08mm. Dambar cannot be located at the lower
radius or the foot. Minimum space between protrusion
and an adjacent lead is 0.07 mm.