Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Q128.14x20F
128 Lead Low Plastic Quad Flatpack Package (LQFP)
D
D1
D2
MILLIMETER
-D-
-B-
E
E1
E2
-A-
4x
e
4x
b
aaa C A-B D
bbb C A-B D
ccc M C A-B S D S
TOP VIEW
S
0.10
SYMBOL
MIN
NOM
MAX
MIN
NOM
MAX
A
-
-
1.60
-
-
0.063
A1
0.05
-
0.15
0.002
-
0.006
A2
1.35
1.40
1.45
0.053
0.055
0.057
D
22.00 BASIC
0.866 BASIC
D1
20.00 BASIC
0.787 BASIC
E
16.00 BASIC
0.630 BASIC
E1
14.00 BASIC
0.551 BASIC
R2
0.08
-
0.20
0.003
-
0.008
R1
0.08
-
-
0.003
-
-

0°
3.5°
7°
0°
3.5°
7°
1
0°
-
-
0°
-
-
2
11°
12°
13°
11°
12°
13°
3
11°
12°
13°
11°
12°
13°
c
0.09
-
0.20
0.004
-
0.008
L
0.45
0.60
0.75
0.018
0.024
0.030
L1
c
1.00 REF
0.039 REF
S
0.20
-
-
0.008
-
-
b
0.170
0.200
0.270
0.007
0.008
0.011
A
A2
A1
INCH
L1
1
e
0.50 BSC
0.020 BSC
D2
18.50
0.728
E2
12.50
0.492
TOLERANCES FORM AND POSITION

-C- SEATING PLANE
ddd
C
SIDE VIEW
aaa
0.20
0.008
bbb
0.20
0.008
ccc
0.08
0.003
ddd
0.08
0.003
REV 2 12/15
NOTES:
1. Dimension D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25mm per side. Dimensions D1 and E1 do include
mold mismatch and are determined at datum plane -H-.
2
R1
R2
-HS
L
GAUGE PLANE
0.25mm
3
DETAIL
1
2. Dimension b does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm total in excess of the b dimension at
maximum material condition. Dambar cannot be located on the
lower radius or the lead foot.