Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L32.5x5G
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 3/10
4X 3.5
5.00
28X 0.50
A
B
25
6
PIN 1
INDEX AREA
32
6
PIN #1
INDEX AREA
1
5.00
24
3 .50
EXP. DAP
17
(4X)
8
0.15
16
9
TOP VIEW
32X 0.40 ± 0.10
4 32X 0.23
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
MAX 1.00
( 4. 80 TYP )
(
C
SEATING PLANE
0.08 C
( 28X 0 . 5 )
SIDE VIEW
3.50 )
(32X 0 . 23 )
C
0 . 2 REF
5
( 32X 0 . 60)
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1