Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L46.4x7
46 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE (TQFN)
Rev 1, 3/13
2.80
4.00
42X 0.40
A
B
6
PIN 1
INDEX AREA
38
7.00
(4X)
46
39
6
PIN 1
INDEX AREA
1
5.50 ±0.1
Exp. DAP
5.60
15
24
0.05
46X 0.20 4
0.10 M C A B
SIDE VIEW
TOP VIEW
16
23
2.50 ±0.1
Exp. DAP
46X 0.40
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0.75 ±0.05
C
SEATING PLANE
0.05 C
SIDE VIEW
C
0.203 REF
5
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
( 3.80 )
( 2.50)
NOTES:
( 6.80 )
( 42X 0.40)
( 5.50 )
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
(46X 0.20)
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
( 46 X 0.60)
TYPICAL RECOMMENDED LAND PATTERN
1