Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L64.9x9A
64 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE WITH TOP EXPOSED PAD (QFN-TEP)
Rev 0, 6/09
2X
A
2
0.10 C A
9.00 BSC
0.23
4X0.42
0.10 M C A B
0.05 M C
8.75 BSC
10
REF.
5.69 BSC
2X
64
0.10 C B
8
1
2
3 4
3
PIN 1
INDEX AREA
10
5.69 BSC
8 9
0.150
64
4X0.42
9
0.275
1
2
3
7.50
REF.
9.00 BSC
8.75 BSC
0.50 BSC
0.10 C B
2X
9
9
0.125 0.150
0.10 C A
B
7.50
REF.
2X
TOP VIEW
BOTTOM VIEW
0.85
13'
MAX
4x 8.80
0.65
0.10 C
C
0.20
REF
SEATING
PLANE
4x7.50
0.01
REF. 6
0.08
SIDE VIEW
(DATUM A OR B)
64 X R
0.42
0.01
0.40
2
7
TERMINAL TIP
0.25
0.50
SECTION "C-C"
SCALE: NONE
(64X 0.60)
(60X 0.50)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensioning & tolerancing conform to ASME Y14.5M-1994.
2.
Dimension b applies to metallized terminal and is measured
between 0.15 and 0.30mm from terminal tip.
3.
The pin #1 identifier must be existed on the top surface of the
package by using indentation mark or other feature of package body.
4.
Exact shape and size of this feature is optional.
5.
All dimensions are in millimeters.
6.
Bilateral coplanarity zone applies to the exposed pad
as well as the terminals.
7.
Applied only for terminals.
8.
The shape shown on four corners are not actual I/O.
9.
R, T or S, U applies only for straight tiebar shapes.
Any mold flash on the exposed tiebar area shall be allowable.
10.
1
D2, E2 dimensions : Nominal exposed pad size.