Plastic Packages for Integrated Circuits Package Outline Drawing L64.9x9A 64 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE WITH TOP EXPOSED PAD (QFN-TEP) Rev 0, 6/09 2X A 2 0.10 C A 9.00 BSC 0.23 4X0.42 0.10 M C A B 0.05 M C 8.75 BSC 10 REF. 5.69 BSC 2X 64 0.10 C B 8 1 2 3 4 3 PIN 1 INDEX AREA 10 5.69 BSC 8 9 0.150 64 4X0.42 9 0.275 1 2 3 7.50 REF. 9.00 BSC 8.75 BSC 0.50 BSC 0.10 C B 2X 9 9 0.125 0.150 0.10 C A B 7.50 REF. 2X TOP VIEW BOTTOM VIEW 0.85 13' MAX 4x 8.80 0.65 0.10 C C 0.20 REF SEATING PLANE 4x7.50 0.01 REF. 6 0.08 SIDE VIEW (DATUM A OR B) 64 X R 0.42 0.01 0.40 2 7 TERMINAL TIP 0.25 0.50 SECTION "C-C" SCALE: NONE (64X 0.60) (60X 0.50) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensioning & tolerancing conform to ASME Y14.5M-1994. 2. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip. 3. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other feature of package body. 4. Exact shape and size of this feature is optional. 5. All dimensions are in millimeters. 6. Bilateral coplanarity zone applies to the exposed pad as well as the terminals. 7. Applied only for terminals. 8. The shape shown on four corners are not actual I/O. 9. R, T or S, U applies only for straight tiebar shapes. Any mold flash on the exposed tiebar area shall be allowable. 10. 1 D2, E2 dimensions : Nominal exposed pad size.