Plastic Packages for Integrated Circuits Package Outline Drawing L28.4x5D 28 LEAD SUPER THIN QUAD FLAT NO LEAD PLASTIC PACKAGE Rev 0, 3/11 PIN 1 INDEX AREA 4.00 A 0.25 MIN B 0.400 ± 0.10 23 PIN #1 INDEX AREA 28 22 1 0.50 3.6 +0.10/-0.15 EXP DAP 5.00 0.20 ±0.05 8 15 0.10 0.05 4 CAB C 0.05 C 4x 14 9 2.60 +0.10/0.15 EXP DAP TOP VIEW BOTTOM VIEW SEE DETAIL “X'' 0.10 C 5 0.38 +0.02/-0.08 0.08 C C C 0.00 MIN 0.05 MAX 0.127 REF SEATING PLANE SIDE VIEW DETAIL "X" (3.20) PACKAGE BOUNDARY NOTES: 28 x (0.20) (4.20) (3.60) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal. If terminal has a 24 x (0.50) radius on its end, dimension should not be measured in that radius area. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be (28 x 0.50) (2.60) TYPICAL RECOMMENDED LAND PATTERN 1 either a mold or mark feature. 7. Reference Document: JEDEC MO-228.