Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L28.4x5D
28 LEAD SUPER THIN QUAD FLAT NO LEAD PLASTIC PACKAGE
Rev 0, 3/11
PIN 1
INDEX AREA
4.00
A
0.25 MIN
B
0.400 ± 0.10
23
PIN #1
INDEX AREA
28
22
1
0.50
3.6 +0.10/-0.15
EXP DAP
5.00
0.20 ±0.05
8
15
0.10
0.05
4
CAB
C
0.05 C
4x
14
9
2.60 +0.10/0.15
EXP DAP
TOP VIEW
BOTTOM VIEW
SEE DETAIL “X''
0.10 C
5
0.38 +0.02/-0.08
0.08 C
C
C
0.00 MIN
0.05 MAX
0.127 REF
SEATING PLANE
SIDE VIEW
DETAIL "X"
(3.20)
PACKAGE
BOUNDARY
NOTES:
28 x (0.20)
(4.20)
(3.60)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal. If terminal has a
24 x (0.50)
radius on its end, dimension should not be measured in that
radius area.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
(28 x 0.50)
(2.60)
TYPICAL RECOMMENDED LAND PATTERN
1
either a mold or mark feature.
7.
Reference Document: JEDEC MO-228.