Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L23.6.5x9
23 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 10/15
13x 0.55
6.500
PIN 1
INDEX AREA
2x 0.60
0.100 M C A B
3.60
6 0.90
1.20
B
13
PIN #1 IDENTIFICATION
CHAMFER 0.300x45
22
12
1
23
36x 0.50
4x 0.550
3.30
2x 1.40
2x 0.42
2x 0.50
9.00
46x 0.22
0.100 M C A B
00.50 M C
2x 0.90
2x 1.49
2x 1.60
2x 1.42
6
7
2x 1.00
0.60
A
22x 0.30
TOP VIEW
6
2x 1.26
2x 1.08
2x 2.70
2x 2.70
2x 0.50
BOTTOM VIEW
SEE DETAIL “X”
0.203 REF
C
4
0.100 C
C
1.90 MAX
SEATING PLANE
0 - 0.05
DETAIL “X”
46X
0.05 C 0.05
SIDE VIEW
NOTES:
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to ASMEY 14.5m-1994.
3. Unless otherwise specified, tolerance: Decimal ± 0.05.
4. Tiebar shown (if present) is a non-functional feature.
5. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
6. Lead pitches not centered in “y” direction.
1
2.950
2.845
0.000
2.655
2.345
2.155
1.845
1.655
1.345
1.155
0.845
0.655
0.655
0.845
1.155
1.345
1.655
1.845
2.155
2.345
2.655
2.845
2.950
2.845
2.168
1.968
1.745
1.545
0.445
0.445
1.545
1.745
1.968
2.168
2.845
0.000
4.100
4.200
3.995
3.805
3.495
3.305
3.995
3.805
3.400
3.495
3.305
1.577
1.577
0.495
0.495
0.373
0.373
0.090
0.000
2
0.090
0.511
0.790
0.790
0.005
0.195
0.505
1.505
1.695
2.005
2.195
2.505
2.695
3.005
3.195
3.325
2.061
2.505
2.560
3.411
3.695
3.505
3.695
4.185
2.850
3.975
4.675
2.845
2.655
2.345
2.155
1.845
1.655
1.345
1.155
0.845
0.655
0.345
0.155
0.155
0.345
0.655
0.845
1.155
1.345
1.655
1.845
2.155
2.345
2.655
2.725
2.845
3.425
2.850
2.845
2.450
1.596
0.100
0.100
1.600
2.450
STENCIL PATTERN WITH 23 MOSLP TOP VIEW
STENCIL PATTERN WITH 23 MOSLP TOP VIEW
0.250
0.250
3.450
3.450
4.700
3.200
3.200
1.777
1.777
0.177
0.010
0.890
1.310
0.890
1.310
0.000
0.140
2.950
2.350
2.860
2.640
2.360
1.860
2.140
1.800
1.640
1.360
1.140
0.860
0.140
0.860
1.140
1.360
1.800
1.640
1.860
2.140
2.360
2.640
2.860
3.950
0.000
0.323
2.710
2.350
2.710
2.990
3.210
3.300
3.490
3.710
4.700
0.177
0.010
0.290
0.290
2.990
3.210
3.490
3.710
3.623
TYPICAL RECOMMENDED LAND PATTERN
0.000
Plastic Packages for Integrated Circuits
0.005
0.195
0.505
0.695
1.505
1.695
2.005
2.195
2.505
2.695
3.005
3.195
3.505
0.695
1.460
1.861
1.460
1.495
1.305
0.995
0.805
0.495
0.305
1.495
1.305
0.995
0.805
0.495
0.305